Inventor

HASHIM IMRAN

US108 patents

⚠️ This page may combine multiple inventors who share the name “HASHIM IMRAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HASHIM IMRAN

APPLIED MATERIALS INC

Method and apparatus for forming improved metal interconnects

Copper alloy seed layer for copper metallization in an integrated circuit

Sputter deposition and annealing of copper alloy metallization

Method for achieving copper fill of high aspect ratio interconnect features

Method and apparatus for forming improved metal interconnects

Method and apparatus for forming improved metal interconnects

Integrated deposition process for copper metallization

Method and apparatus for forming improved metal interconnects

Method of depositing a copper seed layer which promotes improved feature surface coverage

Copper alloy seed layer for copper metallization

Structure and method for improving low temperature copper reflow in semiconductor features

Copper alloy via structure

Integrated deposition process for copper metallization

Method of depositing a copper seed layer which promotes improved feature surface coverage

Coating of vacuum chambers to reduce pump down time and base pressure

Copper sputtering target

Collimated and long throw magnetron sputtering of nickel/iron films for magnetic recording head applications

Integrated deposition process for copper metallization

Structure for improving low temperature copper reflow in semiconductor features

INTERMOLECULAR INC

Diffusion barrier layer for resistive random access memory cells

Resistive-switching memory elements having improved switching characteristics

Current selector for non-volatile memory in a cross bar array based on defect and band engineering metal-dielectric-metal stacks

Methods of combinatorial processing for screening multiple samples on a semiconductor substrate

Resistive random access memory cell having three or more resistive states

DRAM MIM capacitor using non-noble electrodes

Resistive random access memory cells having metal alloy current limiting layers

DRAM MIM capacitor using non-noble electrodes

Resistive random access memory cells having metal alloy current limiting layers

Multifunctional electrode

Methods for depositing high-K dielectrics

Atomic layer deposition of metal oxides for memory applications

Nonvolatile memory device having a current limiting element

Method of forming an asymmetric MIMCAP or a schottky device as a selector element for a cross-bar memory array

Titanium-based high-K dielectric films

WANG YUN

Atomic layer deposition of metal oxide materials for memory applications

Current-limiting layer and a current-reducing layer in a memory device

Method for forming resistive switching memory elements with improved switching behavior

Nonvolatile memory device having a current limiting element

Work function tailoring for nonvolatile memory applications

Atomic layer deposition of metal oxide materials for memory applications

Nonvolatile resistive memory element with an integrated oxygen isolation structure

Nonvolatile resistive memory element with a metal nitride containing switching layer

ADVANCED MICRO DEVICES INC

Method of forming a void free copper interconnects

Monitoring barrier metal deposition for metal interconnect

HASHIM IMRAN

Embedded nonvolatile memory elements having resistive switching characteristics

Yttrium and titanium high-k dielectric films

TENDULKAR MIHIR

Nonvolatile memory device using a tunnel oxide as a current limiter element

Nonvolatile memory device using a varistor as a current limiter element

PHAM HIEU

Transition metal oxide bilayers

APPLE INC

Stacked hybrid micro LED pixel architecture