Inventor
HONG JI-SEOK
KR30 patents
⚠️ This page may combine multiple inventors who share the name “HONG JI-SEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
24 patentsUS11145626B2Oct 12, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD19 citations94
US8901727B2Dec 2, 2014
Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages
SAMSUNG ELECTRONICS CO LTD30 citations89
US11056432B2Jul 6, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD14 citations85
US10886255B2Jan 5, 2021
Die stack structure, semiconductor package having the same and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD17 citations85
US9054228B2Jun 9, 2015
Semiconductor packages including a heat spreader and methods of forming the same
SAMSUNG ELECTRONICS CO LTD12 citations83
US11329024B2May 10, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations73
US10910346B2Feb 2, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations73
US10790264B2Sep 29, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations73
US8940557B2Jan 27, 2015
Method of fabricating wafer level package
SAMSUNG ELECTRONICS CO LTD4 citations72
US11984425B2May 14, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11887900B2Jan 30, 2024
Semiconductor package including test pad
SAMSUNG ELECTRONICS CO LTD0 citations62
US11887968B2Jan 30, 2024
Method of manufacturing a semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11581257B2Feb 14, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11088038B2Aug 10, 2021
Semiconductor package including test pad
SAMSUNG ELECTRONICS CO LTD1 citations62
US8958011B2Feb 17, 2015
Bi-directional camera module and flip chip bonder including the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US8816509B2Aug 26, 2014
Semiconductor package including underfill layers
SAMSUNG ELECTRONICS CO LTD2 citations62
US12040313B2Jul 16, 2024
Semiconductor package and a method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12014977B2Jun 18, 2024
Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US11688679B2Jun 27, 2023
Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US11658148B2May 23, 2023
Semiconductor package and a method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US9159659B2Oct 13, 2015
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US8536045B2Sep 17, 2013
Reflow method
SAMSUNG ELECTRONICS CO LTD0 citations50
US12328869B2Jun 10, 2025
Semiconductor memory devices and methods for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US11824006B2Nov 21, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
KIM MINILL
2 patentsLEE JONG-GI
2 patentsUS8288210B2Oct 16, 2012
Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
LEE JONG-GI4 citations61
US8664762B2Mar 4, 2014
Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
LEE JONG-GI0 citations50