Inventor

GALLEGOS BERNARDO

US20 patents

⚠️ This page may combine multiple inventors who share the name “GALLEGOS BERNARDO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GALLEGOS BERNARDO

TEXAS INSTRUMENTS INC

Semiconductor device having substrate with differentially plated copper and selective solder

Stable gold bump solder connections

Semiconductor package having etched foil capacitor integrated into leadframe

Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer

Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes

Stress relief structure for flip-chip packaged devices

Semiconductor package with nickel-silver pre-plated leadframe

Stress relief for flip-chip packaged devices

Semiconductor package with nickel-silver pre-plated leadframe

Package terminal cavities

Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion

Semiconductor package having etched foil capacitor integrated into leadframe

Substrates with solder barriers on leads

Method of packaging a circuit

Method of making integrated circuit

Leadframe having organic, polymerizable photo-imageable adhesion layer

Semiconductor package having etched foil capacitor integrated into leadframe

GALLEGOS BERNARDO

Packaged electronic devices having die attach regions with selective thin dielectric layer

Packaged electronic devices having die attach regions with selective thin dielectric layer

Integrated circuit and method of making