P

Inventor

CASTRO ABRAM

US18 patents
⚠️ This page may combine multiple inventors who share the name “CASTRO ABRAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

17 patents
US9305869B1Apr 5, 2016

Packaged semiconductor device having leadframe features as pressure valves against delamination

TEXAS INSTRUMENTS INC13 citations83
US9214440B1Dec 15, 2015

Method for preventing die pad delamination

TEXAS INSTRUMENTS INC6 citations83
US9780017B2Oct 3, 2017

Packaged device with additive substrate surface modification

TEXAS INSTRUMENTS INC3 citations73
US9524926B2Dec 20, 2016

Packaged device with additive substrate surface modification

TEXAS INSTRUMENTS INC4 citations73
US10566276B2Feb 18, 2020

Packaged semiconductor system having unidirectional connections to discrete components

TEXAS INSTRUMENTS INC2 citations71
US11495524B2Nov 8, 2022

QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same

TEXAS INSTRUMENTS INC2 citations67
US11838004B2Dec 5, 2023

Acoustic device package and method of making

TEXAS INSTRUMENTS INC0 citations62
US10199348B2Feb 5, 2019

Plastic-packaged semiconductor device having wires with polymerized insulating layer

TEXAS INSTRUMENTS INC1 citations62
US12087673B2Sep 10, 2024

QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same

TEXAS INSTRUMENTS INC0 citations56
US10727085B2Jul 28, 2020

Printed adhesion deposition to mitigate integrated circuit package delamination

TEXAS INSTRUMENTS INC0 citations52
US10347508B2Jul 9, 2019

Printed adhesion deposition to mitigate integrated circuit delamination

TEXAS INSTRUMENTS INC0 citations52
US10284172B2May 7, 2019

Acoustic device package and method of making

TEXAS INSTRUMENTS INC0 citations51
US9875930B2Jan 23, 2018

Method of packaging a circuit

TEXAS INSTRUMENTS INC1 citations51
US9601414B2Mar 21, 2017

Method for preventing die pad delamination

TEXAS INSTRUMENTS INC0 citations51
US9536781B2Jan 3, 2017

Method of making integrated circuit

TEXAS INSTRUMENTS INC0 citations51
US9378984B2Jun 28, 2016

Packaging a semiconductor device having wires with polymerized insulator skin

TEXAS INSTRUMENTS INC0 citations51
US10756013B2Aug 25, 2020

Packaged semiconductor system having unidirectional connections to discrete components

TEXAS INSTRUMENTS INC0 citations50

GALLEGOS BERNARDO

1 patent