Inventor

YANG MING-SHENG

TW57 patents

⚠️ This page may combine multiple inventors who share the name “YANG MING-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANG MING-SHENG

UNITED MICROELECTRONICS CORP

Air gap for dual damascene applications

Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device

Air gap for tungsten/aluminum plug applications

Method for improving surface wettability of low k material

Method for depositing silicon carbide in semiconductor devices

Low-K dual damascene integration process

Method of manufacturing multilevel interconnects including performing a surface treatment to form a hydrophilic surface layer

Method for gap filling

Method for improving non-uniformity of chemical mechanical polishing by over coating

Method of improving surface planarity of chemical-mechanical polishing operation by forming shallow dummy pattern

Forming copper interconnects in dielectric materials with low constant dielectrics

Method of forming a dual damascene with dummy metal lines

Method of forming dual damascene structure

Method fabricating metal interconnected structure

Chemical-mechanical polishing station with end-point monitoring device

Method of forming interconnect structure with low dielectric constant

Chemical mechanical polishing in forming semiconductor device

Method of forming a thin film on a semiconductor wafer

Process for spin-on coating with an organic material having a low dielectric constant

In-situ slurry mixing apparatus

Method of manufacturing a semiconductor device

Method of preventing leakage current of a metal-oxide semiconductor transistor

Method for increasing adhesion ability of dielectric material in semiconductor

Chemical-mechanical polishing method

Method for stripping a low dielectric film with high carbon content

Method of forming inter-metal dielectric layer

Method of forming an intermetal dielectric layer

Chemical mechanical polishing apparatus for controlling slurry distribution

Post-CMP wafer clean process

Method for removing carbon-rich particles adhered on a copper surface

Method of removing silicon carbide

Method of removing micro-scratch on metal layer

Method of manufacturing dual damascene structure

Chemical mechanical polishing methods using low pH slurry mixtures

Cleaning solution for cleaning a polishing pad used in a chemical-mechanical polishing process

Chemical mechanical polishing method for copper

Method of planarization

Method of mixing slurries

Method for forming a multilevel interconnect

Chemical mechanical polishing in forming semiconductor device

Method of fabricating low dielectric constant film

HUANG CHAO-YUAN

Stacked chip system

Integrated circuit layout

UNIV NAT CHI NAN

Switchable readout device

Switchable readout device

UNITED MICORELECTRONICS CORP

Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device

CHI MEI CORP

Liner for a cargo container

PERSONAL GENOMICS INC

Optical sensor and manufacturing method thereof

UNITED MICROELECTRONICS CROP

Method of forming an intermetal dielectric layer

IPENVAL CONSULTANT INC

Semiconductor device