Inventor
SU MICHAEL Z
US24 patents
⚠️ This page may combine multiple inventors who share the name “SU MICHAEL Z”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SU MICHAEL Z
12 patentsUS8299633B2Oct 30, 2012
Semiconductor chip device with solder diffusion protection
SU MICHAEL Z48 citations97
US8691626B2Apr 8, 2014
Semiconductor chip device with underfill
SU MICHAEL Z24 citations92
US8338961B2Dec 25, 2012
Semiconductor chip with reinforcing through-silicon-vias
SU MICHAEL Z15 citations92
US8193039B2Jun 5, 2012
Semiconductor chip with reinforcing through-silicon-vias
SU MICHAEL Z22 citations92
US8866276B2Oct 21, 2014
Semiconductor chip device with polymeric filler trench
SU MICHAEL Z11 citations84
US8624404B1Jan 7, 2014
Integrated circuit package having offset vias
SU MICHAEL Z7 citations84
US8759962B2Jun 24, 2014
Semiconductor chip device with solder diffusion protection
SU MICHAEL Z6 citations83
US8749254B2Jun 10, 2014
Power cycling test arrangement
SU MICHAEL Z9 citations83
US8394672B2Mar 12, 2013
Method of manufacturing and assembling semiconductor chips with offset pads
SU MICHAEL Z5 citations73
US9793239B2Oct 17, 2017
Semiconductor workpiece with selective backside metallization
SU MICHAEL Z3 citations70
US8617926B2Dec 31, 2013
Semiconductor chip device with polymeric filler trench
SU MICHAEL Z3 citations62
US8293581B2Oct 23, 2012
Semiconductor chip with protective scribe structure
SU MICHAEL Z0 citations41
REFAI-AHMED GAMAL
4 patentsUS8472190B2Jun 25, 2013
Stacked semiconductor chip device with thermal management
REFAI-AHMED GAMAL24 citations92
US8574965B2Nov 5, 2013
Semiconductor chip device with liquid thermal interface material
REFAI-AHMED GAMAL8 citations84
US9385055B2Jul 5, 2016
Stacked semiconductor chips with thermal management
REFAI-AHMED GAMAL13 citations83
US8796842B2Aug 5, 2014
Stacked semiconductor chip device with thermal management circuit board
REFAI-AHMED GAMAL5 citations73