Inventor

TUNGA KRISHNA R

US38 patents

⚠️ This page may combine multiple inventors who share the name “TUNGA KRISHNA R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TUNGA KRISHNA R

IBM

Final passivation for wafer level warpage and ULK stress reduction

Laminated stiffener to control the warpage of electronic chip carriers

Electronic package cover having underside rib

Electronic package with tapered pedestal

Reduction of solder interconnect stress

Determining crackstop strength of integrated circuit assembly at the wafer level

Enlarged conductive pad structures for enhanced chip bond assembly yield

Decoupling capacitor stiffener

Optimized individual sleep patterns

Language learning and speech enhancement through natural language processing

Behavior-based interactive educational sessions

Reduction of solder interconnect stress

Asymmetric die bonding

Internet of things (IoT) real-time response to defined symptoms

Mitigating cooldown peeling stress during chip package assembly

Internet of things (IOT) real-time response to defined symptoms

Lead-free column interconnect

Control warpage in a semiconductor chip package

Multipart lid for a semiconductor package with multiple components

Mitigating thermal-mechanical strain and warpage of an organic laminate substrate

Language learning and speech enhancement through natural language processing

Managing thermal warpage of a laminate

Method of forming an electronic package

Electronic package cover having underside rib

Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress

Electronic package cover having underside rib

In-plane copper imbalance for warpage prediction

Multichip electronic packages and methods of manufacture

Mitigating cracking within integrated circuit (IC) device carrier

Final passivation for wafer level warpage and ULK stress reduction

Optimized individual sleep patterns

Test cell for laminate and method

Test cell for laminate and method

Laminate substrate thermal warpage prediction for designing a laminate substrate

Connected plane stiffener within integrated circuit chip carrier

SIKKA KAMAL K

Multichip electronic packages and methods of manufacture

ELPIS TECH INC

Multipart lid for a semiconductor package with multiple components

BODENWEBER PAUL F

Non-hermetic sealed multi-chip module package