Inventor

CHANG HUNG-PIN

TW41 patents

⚠️ This page may combine multiple inventors who share the name “CHANG HUNG-PIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG HUNG-PIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Isolation structure for stacked dies

Semiconductor structure and manufacturing method thereof

Conductive vias in semiconductor packages and methods of forming same

System, structure, and method of manufacturing a semiconductor substrate stack

Semiconductor device and method

Semiconductor device and method

Semiconductor device and method

Semiconductor device and method

Semiconductor structure and manufacturing method thereof

Semiconductor device and method

System, structure, and method of manufacturing a semiconductor substrate stack

Method of manufacturing a semiconductor device including through silicon plugs

System, structure, and method of manufacturing a semiconductor substrate stack

Semiconductor package and method

Conductive vias in semiconductor packages and methods of forming same

Method of manufacturing a semiconductor device including through silicon plugs

Through via structure and method

Backside through vias in a bonded structure

CHANG HUNG-PIN

Method of forming bump structure having tapered sidewalls for stacked dies

System, structure, and method of manufacturing a semiconductor substrate stack

Multi-layer interconnect structure for stacked dies

Reduction of etch microloading for through silicon vias

Multi-layer interconnect structure for stacked dies

Via structure and via etching process of forming the same

TAIWAN SEMICONDUCTOR MFG

Bump structure for stacked dies

Backside through vias in a bonded structure

Via structure and via etching process of forming the same

Reduction of etch microloading for through silicon vias

Method of manufacturing a semiconductor device including through silicon plugs

Cost-effective TSV formation

UNIV CALIFORNIA

MEMS fabrication on a laminated substrate

High isolation tunable MEMS capacitive switch

High isolation tunable MEMS capacitive switch

MEMS fabrication on a laminated substrate

YU CHEN-HUA

Semiconductor package with through silicon vias

Heat dissipation by through silicon plugs

Bump with protection structure

YANG KU-FENG

Cost-effective TSV formation

DONGGUAN MASSTOP LIQUID CRYSTAL DISPLAY CO LTD

Light tube

WANG CHIEN RHONE

Apparatus and methods for end point determination in reactive ion etching

QIAN JIANGYUAN

Method of fabricating a radio frequency (RF) microelectromechanical system (MEMS) asymmetrical switch