Inventor
LEE NING-CHENG
US32 patents
⚠️ This page may combine multiple inventors who share the name “LEE NING-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INDIUM CORP
21 patentsUS8348139B2Jan 8, 2013
Composite solder alloy preform
INDIUM CORP25 citations92
US11229979B2Jan 25, 2022
High reliability lead-free solder alloys for harsh environment electronics applications
INDIUM CORP1 citations73
US9636784B2May 2, 2017
Mixed alloy solder paste
INDIUM CORP3 citations72
US11267080B2Mar 8, 2022
Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
INDIUM CORP5 citations69
US10888958B2Jan 12, 2021
Hybrid high temperature lead-free solder preform
INDIUM CORP2 citations68
US9741676B1Aug 22, 2017
Tin-indium based low temperature solder alloy
INDIUM CORP3 citations64
US12090579B2Sep 17, 2024
High reliability lead-free solder alloys for harsh environment electronics applications
INDIUM CORP0 citations62
US11413709B2Aug 16, 2022
High reliability lead-free solder alloys for harsh environment electronics applications
INDIUM CORP0 citations62
US11752579B2Sep 12, 2023
High reliability leadfree solder alloys for harsh service conditions
INDIUM CORP1 citations60
US11712762B2Aug 1, 2023
Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
INDIUM CORP0 citations59
US12240060B2Mar 4, 2025
SnIn solder alloys
INDIUM CORP0 citations58
US11999018B2Jun 4, 2024
SnBi and SnIn solder alloys
INDIUM CORP0 citations58
US11807536B2Nov 7, 2023
Method for preparing graphite sheets with piercing treatment to enhance thermal conduction
INDIUM CORP0 citations56
US11738411B2Aug 29, 2023
Lead-free solder paste with mixed solder powders for high temperature applications
INDIUM CORP1 citations53
US11581239B2Feb 14, 2023
Lead-free solder paste as thermal interface material
INDIUM CORP0 citations52
US10328533B2Jun 25, 2019
Hybrid lead-free solder wire
INDIUM CORP0 citations51
US10118260B2Nov 6, 2018
Mixed alloy solder paste
INDIUM CORP1 citations51
US9802274B2Oct 31, 2017
Hybrid lead-free solder wire
INDIUM CORP0 citations51
US10756039B2Aug 25, 2020
Fluxes effective in suppressing non-wet-open at BGA assembly
INDIUM CORP0 citations48
US9875983B2Jan 23, 2018
Nanomicrocrystallite paste for pressureless sintering
INDIUM CORP0 citations47
US10813228B2Oct 20, 2020
Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material
INDIUM CORP0 citations28
INDIUM CORP AMERICA
5 patentsUS7017795B2Mar 28, 2006
Solder pastes for providing high elasticity, low rigidity solder joints
INDIUM CORP AMERICA26 citations90
US6610559B2Aug 26, 2003
Integrated void-free process for assembling a solder bumped chip
INDIUM CORP AMERICA51 citations89
US6677179B2Jan 13, 2004
Method of applying no-flow underfill
INDIUM CORP AMERICA13 citations77
US7749336B2Jul 6, 2010
Technique for increasing the compliance of tin-indium solders
INDIUM CORP AMERICA2 citations56
US7749340B2Jul 6, 2010
Technique for increasing the compliance of lead-free solders containing silver
INDIUM CORP AMERICA4 citations56