Inventor
CHING JR MARIANO LAYSON
CN8 patents
⚠️ This page may combine multiple inventors who share the name “CHING JR MARIANO LAYSON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
7 patentsUS10446476B2Oct 15, 2019
Packaged integrated circuit having stacked die and method for therefor
NXP USA INC3 citations70
US10151658B2Dec 11, 2018
Pressure-sensing integrated circuit device with diaphragm
NXP USA INC6 citations66
US11984408B2May 14, 2024
Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation
NXP USA INC0 citations58
US10734311B2Aug 4, 2020
Hybrid lead frame for semiconductor die package with improved creepage distance
NXP USA INC0 citations47
US11923275B2Mar 5, 2024
Lead-frame assembly, semiconductor package and methods for improved adhesion
NXP USA INC0 citations46
US10847449B2Nov 24, 2020
Lead frame with selective patterned plating
NXP USA INC0 citations46
US10734327B2Aug 4, 2020
Lead reduction for improved creepage distance
NXP USA INC0 citations34