Inventor

TUNG TSAN-HUA

TW7 patents

⚠️ This page may combine multiple inventors who share the name “TUNG TSAN-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

4 patents

US10964594B2Mar 30, 2021

Methods of packaging semiconductor devices including placing semiconductor devices into die caves

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US9673098B2Jun 6, 2017

Methods of packaging semiconductor devices and structures thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62

US10163711B2Dec 25, 2018

Methods of packaging semiconductor devices including placing semiconductor devices into die caves

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

US9406581B2Aug 2, 2016

Methods of packaging semiconductor devices and structures thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

LIN JING-CHENG

2 patents

US9000584B2Apr 7, 2015

Packaged semiconductor device with a molding compound and a method of forming the same

LIN JING-CHENG1,021 citations98

US9117682B2Aug 25, 2015

Methods of packaging semiconductor devices and structures thereof

LIN JING-CHENG1 citations61

TAIWAN SEMICONDUCTOR MFG

1 patent

US9312148B2Apr 12, 2016

Method of packaging a semiconductor device

TAIWAN SEMICONDUCTOR MFG3 citations72