P

Inventor

IYENGAR MADHUSUDAN K

US295 patents
⚠️ This page may combine multiple inventors who share the name “IYENGAR MADHUSUDAN K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

41 patents
US8014150B2Sep 6, 2011

Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling

IBM184 citations99
US7477514B2Jan 13, 2009

Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations

IBM150 citations99
US6973801B1Dec 13, 2005

Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack

IBM194 citations99
US9357675B2May 31, 2016

Pump-enhanced, immersion-cooling of electronic component(s)

IBM64 citations98
US9321136B2Apr 26, 2016

Multi-rack, door-mounted heat exchanger

IBM39 citations98
US9095942B2Aug 4, 2015

Wicking and coupling element(s) facilitating evaporative cooling of component(s)

IBM46 citations98
US8817465B2Aug 26, 2014

Multi-rack assembly with shared cooling apparatus

IBM57 citations98
US8797740B2Aug 5, 2014

Multi-rack assembly method with shared cooling unit

IBM66 citations98
US8351206B2Jan 8, 2013

Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit

IBM100 citations98
US8018720B2Sep 13, 2011

Condenser structures with fin cavities facilitating vapor condensation cooling of coolant

IBM66 citations98
US7983040B2Jul 19, 2011

Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem

IBM62 citations98
US7979250B2Jul 12, 2011

Method of laying out a data center using a plurality of thermal simulators

IBM85 citations98
US7978473B2Jul 12, 2011

Cooling apparatus with cold plate formed in situ on a surface to be cooled

IBM68 citations98
US7978472B2Jul 12, 2011

Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof

IBM59 citations98
US7969736B1Jun 28, 2011

System for cooling memory modules

IBM78 citations98
US7967062B2Jun 28, 2011

Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof

IBM111 citations98
US7963119B2Jun 21, 2011

Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center

IBM115 citations98
US7961475B2Jun 14, 2011

Apparatus and method for facilitating immersion-cooling of an electronic subsystem

IBM80 citations98
US7944694B2May 17, 2011

Liquid cooling apparatus and method for cooling blades of an electronic system chassis

IBM89 citations98
US7916483B2Mar 29, 2011

Open flow cold plate for liquid cooled electronic packages

IBM103 citations98
US7907406B1Mar 15, 2011

System and method for standby mode cooling of a liquid-cooled electronics rack

IBM107 citations98
US7885070B2Feb 8, 2011

Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow

IBM99 citations98
US7791882B2Sep 7, 2010

Energy efficient apparatus and method for cooling an electronics rack

IBM109 citations98
US7762314B2Jul 27, 2010

Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways

IBM84 citations98
US7724524B1May 25, 2010

Hybrid immersion cooled server with integral spot and bath cooling

IBM100 citations98
US7660109B2Feb 9, 2010

Apparatus and method for facilitating cooling of an electronics system

IBM69 citations98
US7660121B2Feb 9, 2010

System of facilitating cooling of electronics racks of a data center employing multiple cooling stations

IBM65 citations98
US7657347B2Feb 2, 2010

Temperature-based monitoring method and system for determining first and second fluid flow rates through a heat exchanger

IBM70 citations98
US7641101B2Jan 5, 2010

Method of assembling a cooling system for a multi-component electronics system

IBM72 citations98
US7639499B1Dec 29, 2009

Liquid cooling apparatus and method for facilitating cooling of an electronics system

IBM128 citations98
US7630795B2Dec 8, 2009

Method and air-cooling unit with dynamic airflow and heat removal adjustability

IBM88 citations98
US7511957B2Mar 31, 2009

Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled

IBM87 citations98
US7486512B2Feb 3, 2009

Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region

IBM61 citations98
US7450385B1Nov 11, 2008

Liquid-based cooling apparatus for an electronics rack

IBM142 citations98
US7420808B2Sep 2, 2008

Liquid-based cooling system for cooling a multi-component electronics system

IBM59 citations98
US7397661B2Jul 8, 2008

Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow

IBM104 citations98
US7380409B2Jun 3, 2008

Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing

IBM68 citations98
US7375962B2May 20, 2008

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

IBM66 citations98
US7366632B2Apr 29, 2008

Method and apparatus for three-dimensional measurements

IBM85 citations98
US7362574B2Apr 22, 2008

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

IBM68 citations98
US7349213B2Mar 25, 2008

Coolant control unit, and cooled electronics system and method employing the same

IBM85 citations98

CAMPBELL LEVI A

8 patents

CHAINER TIMOTHY J

1 patent

Showing the top 50 of 295 patents by PatentIndex Score.