Inventor

SCHMIDT ROGER R

US248 patents

⚠️ This page may combine multiple inventors who share the name “SCHMIDT ROGER R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHMIDT ROGER R

IBM

Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations

Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack

Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems

Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack

Method and system for cooling electronics racks using pre-cooled air

Drawer-level immersion-cooling with hinged, liquid-cooled heat sink

Pump-enhanced, immersion-cooling of electronic component(s)

Liquid-cooled heat sink assemblies

Multi-rack, door-mounted heat exchanger

Wicking and coupling element(s) facilitating evaporative cooling of component(s)

Method of laying out a data center using a plurality of thermal simulators

Cooling apparatus with cold plate formed in situ on a surface to be cooled

Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof

Energy efficient apparatus and method for cooling an electronics rack

Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways

System and method for facilitating cooling of a liquid-cooled electronics rack

Apparatus and method for facilitating cooling of an electronics system

System of facilitating cooling of electronics racks of a data center employing multiple cooling stations

Method of assembling a cooling system for a multi-component electronics system

Liquid cooling apparatus and method for facilitating cooling of an electronics system

Method and air-cooling unit with dynamic airflow and heat removal adjustability

Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled

Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region

Liquid-based cooling apparatus for an electronics rack

Liquid-based cooling system for cooling a multi-component electronics system

Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow

Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

Method and apparatus for three-dimensional measurements

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region

Coolant control unit, and cooled electronics system and method employing the same

Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins

Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled

Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled

Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region

Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold

Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths

Multi-element heat exchange assemblies and methods of fabrication for a cooling system

Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins

Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins

Condensate removal system and method for facilitating cooling of an electronics system

Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems

Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack

Frame level partial cooling boost for drawer and/or node level processors

Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover

Method for combined air and liquid cooling of stacked electronics components

CHAINER TIMOTHY J

Dynamically limiting energy consumed by cooling apparatus

INTERNAT BUSINESS MACHINES COM

Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly