Inventor
RAVKIN MIKE
US50 patents
⚠️ This page may combine multiple inventors who share the name “RAVKIN MIKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
39 patentsUS6594847B1Jul 22, 2003
Single wafer residue, thin film removal and clean
LAM RES CORP112 citations97
US7069937B2Jul 4, 2006
Vertical proximity processor
LAM RES CORP49 citations96
US6488040B1Dec 3, 2002
Capillary proximity heads for single wafer cleaning and drying
LAM RES CORP178 citations96
US6361414B1Mar 26, 2002
Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
LAM RES CORP83 citations96
US7234477B2Jun 26, 2007
Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
LAM RES CORP55 citations95
US6616772B2Sep 9, 2003
Methods for wafer proximity cleaning and drying
LAM RES CORP110 citations95
US7153400B2Dec 26, 2006
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
LAM RES CORP33 citations93
US6858091B2Feb 22, 2005
Method for controlling galvanic corrosion effects on a single-wafer cleaning system
LAM RES CORP19 citations92
US6435952B1Aug 20, 2002
Apparatus and method for qualifying a chemical mechanical planarization process
LAM RES CORP36 citations92
US6375540B1Apr 23, 2002
End-point detection system for chemical mechanical posing applications
LAM RES CORP17 citations92
US6622335B1Sep 23, 2003
Drip manifold for uniform chemical delivery
LAM RES CORP32 citations91
US6543084B2Apr 8, 2003
Wafer scrubbing brush core
LAM RES CORP20 citations90
US6240588B1Jun 5, 2001
Wafer scrubbing brush core
LAM RES CORP34 citations90
US7799141B2Sep 21, 2010
Method and system for using a two-phases substrate cleaning compound
LAM RES CORP8 citations84
US7632376B1Dec 15, 2009
Method and apparatus for atomic layer deposition (ALD) in a proximity system
LAM RES CORP15 citations84
US6537381B1Mar 25, 2003
Method for cleaning and treating a semiconductor wafer after chemical mechanical polishing
LAM RES CORP19 citations84
US7997288B2Aug 16, 2011
Single phase proximity head having a controlled meniscus for treating a substrate
LAM RES CORP8 citations83
US7350315B2Apr 1, 2008
Edge wheel dry manifold
LAM RES CORP11 citations82
US7387689B2Jun 17, 2008
Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
LAM RES CORP6 citations74
US7264007B2Sep 4, 2007
Method and apparatus for cleaning a substrate using megasonic power
LAM RES CORP4 citations74
US7029369B2Apr 18, 2006
End-point detection apparatus
LAM RES CORP8 citations74
US6726530B2Apr 27, 2004
End-point detection system for chemical mechanical polishing applications
LAM RES CORP6 citations74
US7703462B2Apr 27, 2010
Reduction of entrance and exit marks left by a substrate-processing meniscus
LAM RES CORP4 citations73
US7946303B2May 24, 2011
Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus
LAM RES CORP4 citations72
US6711775B2Mar 30, 2004
System for cleaning a semiconductor wafer
LAM RES CORP12 citations72
US6611326B1Aug 26, 2003
System and apparatus for evaluating the effectiveness of wafer drying operations
LAM RES CORP7 citations71
US6521050B1Feb 18, 2003
Methods for evaluating advanced wafer drying techniques
LAM RES CORP9 citations71
US7947157B2May 24, 2011
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
LAM RES CORP5 citations63
US7591613B2Sep 22, 2009
Method and apparatus for transporting a substrate using non-newtonian fluid
LAM RES CORP3 citations63
US7464719B2Dec 16, 2008
Multi-menisci processing apparatus
LAM RES CORP3 citations63
US7416370B2Aug 26, 2008
Method and apparatus for transporting a substrate using non-Newtonian fluid
LAM RES CORP2 citations63
US6679763B2Jan 20, 2004
Apparatus and method for qualifying a chemical mechanical planarization process
LAM RES CORP4 citations63
US8043441B2Oct 25, 2011
Method and apparatus for cleaning a substrate using non-Newtonian fluids
LAM RES CORP4 citations62
US7614411B2Nov 10, 2009
Controls of ambient environment during wafer drying using proximity head
LAM RES CORP2 citations62
US7939139B2May 10, 2011
Methods for atomic layer deposition (ALD) using a proximity meniscus
LAM RES CORP0 citations52
US7897213B2Mar 1, 2011
Methods for contained chemical surface treatment
LAM RES CORP0 citations52
US7568490B2Aug 4, 2009
Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
LAM RES CORP0 citations52
US6827793B2Dec 7, 2004
Drip manifold for uniform chemical delivery
LAM RES CORP0 citations51
US7780825B2Aug 24, 2010
Substrate gripper with integrated electrical contacts
LAM RES CORP0 citations50
O'DONNELL ROBERT
4 patentsUS8623152B2Jan 7, 2014
Reduction of entrance and exit marks left by a substrate-processing meniscus
O'DONNELL ROBERT0 citations51
US8317932B2Nov 27, 2012
Reduction of entrance and exit marks left by a substrate-processing meniscus
O'DONNELL ROBERT0 citations51
US8534303B2Sep 17, 2013
Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus
O'DONNELL ROBERT0 citations50
US8105441B2Jan 31, 2012
Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus
O'DONNELL ROBERT0 citations50