P

Inventor

RAVKIN MIKE

US50 patents
⚠️ This page may combine multiple inventors who share the name “RAVKIN MIKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

39 patents
US6594847B1Jul 22, 2003

Single wafer residue, thin film removal and clean

LAM RES CORP112 citations97
US7069937B2Jul 4, 2006

Vertical proximity processor

LAM RES CORP49 citations96
US6488040B1Dec 3, 2002

Capillary proximity heads for single wafer cleaning and drying

LAM RES CORP178 citations96
US6361414B1Mar 26, 2002

Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process

LAM RES CORP83 citations96
US7234477B2Jun 26, 2007

Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

LAM RES CORP55 citations95
US6616772B2Sep 9, 2003

Methods for wafer proximity cleaning and drying

LAM RES CORP110 citations95
US7153400B2Dec 26, 2006

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

LAM RES CORP33 citations93
US6858091B2Feb 22, 2005

Method for controlling galvanic corrosion effects on a single-wafer cleaning system

LAM RES CORP19 citations92
US6435952B1Aug 20, 2002

Apparatus and method for qualifying a chemical mechanical planarization process

LAM RES CORP36 citations92
US6375540B1Apr 23, 2002

End-point detection system for chemical mechanical posing applications

LAM RES CORP17 citations92
US6622335B1Sep 23, 2003

Drip manifold for uniform chemical delivery

LAM RES CORP32 citations91
US6543084B2Apr 8, 2003

Wafer scrubbing brush core

LAM RES CORP20 citations90
US6240588B1Jun 5, 2001

Wafer scrubbing brush core

LAM RES CORP34 citations90
US7799141B2Sep 21, 2010

Method and system for using a two-phases substrate cleaning compound

LAM RES CORP8 citations84
US7632376B1Dec 15, 2009

Method and apparatus for atomic layer deposition (ALD) in a proximity system

LAM RES CORP15 citations84
US6537381B1Mar 25, 2003

Method for cleaning and treating a semiconductor wafer after chemical mechanical polishing

LAM RES CORP19 citations84
US7997288B2Aug 16, 2011

Single phase proximity head having a controlled meniscus for treating a substrate

LAM RES CORP8 citations83
US7350315B2Apr 1, 2008

Edge wheel dry manifold

LAM RES CORP11 citations82
US7387689B2Jun 17, 2008

Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

LAM RES CORP6 citations74
US7264007B2Sep 4, 2007

Method and apparatus for cleaning a substrate using megasonic power

LAM RES CORP4 citations74
US7029369B2Apr 18, 2006

End-point detection apparatus

LAM RES CORP8 citations74
US6726530B2Apr 27, 2004

End-point detection system for chemical mechanical polishing applications

LAM RES CORP6 citations74
US7703462B2Apr 27, 2010

Reduction of entrance and exit marks left by a substrate-processing meniscus

LAM RES CORP4 citations73
US7946303B2May 24, 2011

Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus

LAM RES CORP4 citations72
US6711775B2Mar 30, 2004

System for cleaning a semiconductor wafer

LAM RES CORP12 citations72
US6611326B1Aug 26, 2003

System and apparatus for evaluating the effectiveness of wafer drying operations

LAM RES CORP7 citations71
US6521050B1Feb 18, 2003

Methods for evaluating advanced wafer drying techniques

LAM RES CORP9 citations71
US7947157B2May 24, 2011

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

LAM RES CORP5 citations63
US7591613B2Sep 22, 2009

Method and apparatus for transporting a substrate using non-newtonian fluid

LAM RES CORP3 citations63
US7464719B2Dec 16, 2008

Multi-menisci processing apparatus

LAM RES CORP3 citations63
US7416370B2Aug 26, 2008

Method and apparatus for transporting a substrate using non-Newtonian fluid

LAM RES CORP2 citations63
US6679763B2Jan 20, 2004

Apparatus and method for qualifying a chemical mechanical planarization process

LAM RES CORP4 citations63
US8043441B2Oct 25, 2011

Method and apparatus for cleaning a substrate using non-Newtonian fluids

LAM RES CORP4 citations62
US7614411B2Nov 10, 2009

Controls of ambient environment during wafer drying using proximity head

LAM RES CORP2 citations62
US7939139B2May 10, 2011

Methods for atomic layer deposition (ALD) using a proximity meniscus

LAM RES CORP0 citations52
US7897213B2Mar 1, 2011

Methods for contained chemical surface treatment

LAM RES CORP0 citations52
US7568490B2Aug 4, 2009

Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids

LAM RES CORP0 citations52
US6827793B2Dec 7, 2004

Drip manifold for uniform chemical delivery

LAM RES CORP0 citations51
US7780825B2Aug 24, 2010

Substrate gripper with integrated electrical contacts

LAM RES CORP0 citations50

O'DONNELL ROBERT

4 patents

DE LARIOS JOHN M

2 patents

KOROLIK MIKHAIL

2 patents

LAM RES AG

1 patent

MAGNI ENRICO

1 patent

RAVKIN MIKE

1 patent