Inventor

SAKETI POOYA

IE41 patents

⚠️ This page may combine multiple inventors who share the name “SAKETI POOYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAKETI POOYA

FACEBOOK TECH LLC

Direct wafer mapping and selective elastomer deposition

Manufacture LED displays using temporary carriers

Lenses integrated with micro-light emitting diodes

Selective shape memory alloy pick-up head

Rigid pickup head with conformable layer

Method for polymer-assisted chip transfer

Forming conformable layer with flap on semiconductor devices

Washable mold for conformable layer formation on semiconductor devices

Pickup head with touch down sensor

Etchant-accessible carrier substrate for display manufacture

Micro-LED pick and place using metallic gallium

Bonding corners of light emitting diode chip to substrate using laser

Pickup head with photocurable polymers for assembling light emitting diodes

Vacuum pick-up head for semiconductor chips

Method of direct wafer mapping by determining operational LEDs from non-operational LEDs using photo-reactive elastomer deposition

Formation of elastomeric layer on selective regions of light emitting device

Flexible interconnect using conductive adhesive

Curved pillar interconnects

Assembly of semiconductor devices using multiple LED placement cycles

Assembly of semiconductor devices

Liquid crystalline elastomer for pick and place of semiconductor devices

Fluidic pick-up head for assembling light emitting diodes

Bonding dummy electrodes of light emitting diode chip to substrate

Display fabrication microassembly system

Selective inking head for semiconductor devices

Micro light emitting diode with remnants of fabrication substrate for structural support

Optics formation using pick-up tools

Atomic force microscopy tips for interconnection

Formation of elastomeric layer on selective regions of light emitting device

Eye tracking using reverse-biased light-emitting diode devices

Using underfill or flux to promote placing and parallel bonding of light emitting diodes

Picking up and placing of micro light emitting diodes using polygon tool

Formation of elastomeric layer on selective regions of light emitting device

Method for polymer-assisted chip transfer

Integrated elastomeric interface layer formation and singulation for light emitting diodes

Method for polymer-assisted chip transfer

META PLATFORMS TECH LLC

Detection of force applied by pick-up tool for transferring semiconductor devices

Forming conformable layer with flap on semiconductor devices

Bridge pick-up head for transferring semiconductor devices

OCULUS VR LLC

Micro-LED pick and place using metallic gallium

FACEBOOK TECHNOLOGIES LLC

Microspring probe card with insulation block