Inventor

KOLLER SONJA

DE26 patents

⚠️ This page may combine multiple inventors who share the name “KOLLER SONJA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOLLER SONJA

INTEL IP CORP

Integrated circuit package configurations to reduce stiffness

Integrated circuit devices with front-end metal structures

Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus

Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus

Interposer with conductive routing exposed on sidewalls

Power mesh-on-die trace bumping

Power mesh-on-die trace bumping

Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device

Integrated circuit package configurations to reduce stiffness

Integrated circuit package configurations to reduce stiffness

Cooler for semiconductor devices

Thermal contacts at periphery of integrated circuit packages

Device with switchable heat path

Semiconductor devices, and a method for forming a semiconductor device

Low thermal resistance hanging die package

INTEL CORP

Printed wiring-board islands for connecting chip packages and methods of assembling same

Single metal cavity antenna in package connected to an integrated transceiver front-end

Package integrated cavity resonator antenna

Contact pads for integrated circuit packages

Printed wiring-board islands for connecting chip packages and methods of assembling same

Magnetic coils in locally thinned silicon bridges and methods of assembling same

Packaging architecture with reinforcement structure in package substrate

Semiconductor packages, and methods for forming semiconductor packages

Patch antennas stitched to systems in packages and methods of assembling same

Wearable computing device

Packaging architecture with reinforcement structure in package substrate