Inventor

CHATTERJEE PRITHWISH

US21 patents

⚠️ This page may combine multiple inventors who share the name “CHATTERJEE PRITHWISH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHATTERJEE PRITHWISH

INTEL CORP

Thin film barrier seed metallization in magnetic-plugged through hole inductor

Electronic substrates having embedded dielectric magnetic material to form inductors

Coreless organic packages with embedded die and magnetic inductor structures

Asymmetric cored integrated circuit package supports

Methods of embedding magnetic structures in substrates

Enabling magnetic films in inductors integrated into semiconductor packages

Substrate integrated thin film capacitors using amorphous high-k dielectrics

Coreless electronic substrates having embedded inductors

Coreless organic packages with embedded die and magnetic inductor structures

Substrate integrated thin film capacitors using amorphous high-k dielectrics

Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates

Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch

Substrate integrated thin film capacitors using amorphous high-k dielectrics

Methods for attaching large components in a package substrate for advanced power delivery

Magnetic inductor structures for package devices

Coreless organic packages with embedded die and magnetic inductor structures

Electronic substrates having embedded magnetic material using photo-imagable dielectric layers

Methods of embedding magnetic structures in substrates

Patterning of thin film capacitors in organic substrate packages

In-plane inductors in IC packages

UNIV ARIZONA STATE

Edible supercapacitors