Inventor
LINK LAUREN A
US13 patents
⚠️ This page may combine multiple inventors who share the name “LINK LAUREN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS11189409B2Nov 30, 2021
Electronic substrates having embedded dielectric magnetic material to form inductors
INTEL CORP2 citations72
US10700021B2Jun 30, 2020
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP3 citations72
US10741947B2Aug 11, 2020
Plated through hole socketing coupled to a solder ball to engage with a pin
INTEL CORP2 citations71
US11251113B2Feb 15, 2022
Methods of embedding magnetic structures in substrates
INTEL CORP2 citations70
US11881463B2Jan 23, 2024
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP0 citations62
US11610706B2Mar 21, 2023
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates
INTEL CORP0 citations62
US11574874B2Feb 7, 2023
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch
INTEL CORP0 citations62
US11335632B2May 17, 2022
Magnetic inductor structures for package devices
INTEL CORP1 citations62
US11205626B2Dec 21, 2021
Coreless organic packages with embedded die and magnetic inductor structures
INTEL CORP0 citations62
US11824013B2Nov 21, 2023
Package substrate with reduced interconnect stress
INTEL CORP0 citations61
US11289263B2Mar 29, 2022
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers
INTEL CORP0 citations61
US11862552B2Jan 2, 2024
Methods of embedding magnetic structures in substrates
INTEL CORP0 citations60