Inventor

YU CHUN-HUI

TW58 patents

⚠️ This page may combine multiple inventors who share the name “YU CHUN-HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YU CHUN-HUI

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device and method

Package structure and method of forming the same

Semiconductor package and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor structure comprising at least one system-on-integrated-circuit component

Package structure and manufacturing method thereof

Package having redistribution layer structure with protective layer and method of fabricating the same

Package-on-package structure and manufacturing method thereof

Methods and apparatus for sensor module

Integrated fan-out package and method for fabricating the same

Method for forming chip package structure

Method of multi-chip wafer level packaging

Semiconductor packages and methods of forming the same

Semiconductor device and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor device and method

Semiconductor package and method of fabricating semiconductor package

Package structure and method of forming the same

Semiconductor package structure and method of manufacturing the same

Methods and apparatus for sensor module

Semiconductor device

Semiconductor structure

Semiconductor device

3D semiconductor packages

Package structure

Package having redistribution layer structure with protective layer

Package having redistribution layer structure with protective layer and method of fabricating the same

Semiconductor package and manufacturing method thereof

Semiconductor device including binding agent adhering an integrated circuit device to an interposer

Package structure and method of forming the same

Integrated fan-out package and method for fabricating the same

Semiconductor package and method of fabricating semiconductor package

Package structure and method of forming the same

Semiconductor device

Package structure and manufacturing method thereof

Semiconductor structure including thermal enhanced bonding structure

Semiconductor device

Semiconductor package structure

Semiconductor device

ADVANCED CHIP ENG TECH INC

FBGA and COB package structure for image sensor

Structure of dielectric layers in built-up layers of wafer level package

System-in-package and manufacturing method of the same

RF module package for releasing stress

YEE KUO-CHUNG

Methods and apparatus for sensor module

Method of fabricating three dimensional integrated circuit

YU CHUN HUI

Multi-chip wafer level package

Method of forming interconnects for three dimensional integrated circuit

YU CHEN-HUA

Molded chip interposer structure and methods

TAIWAN SEMICONDUCTOR MFG

Molded chip interposer structure and methods

ADVANCED CHIP ENGINEERING TACH

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP