Inventor
HUNG JENG-NAN
TW15 patents
Patents
15 patentsUS11380645B2Jul 5, 2022
Semiconductor structure comprising at least one system-on-integrated-circuit component
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US11355418B2Jun 7, 2022
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11139223B2Oct 5, 2021
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10373931B2Aug 6, 2019
Semiconductor package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11854936B2Dec 26, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11830844B2Nov 28, 2023
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11574853B2Feb 7, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12444665B2Oct 14, 2025
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12341079B2Jun 24, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261142B2Mar 25, 2025
Semiconductor structure including thermal enhanced bonding structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756852B2Sep 12, 2023
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11640954B2May 2, 2023
Semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11328975B2May 10, 2022
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10971475B2Apr 6, 2021
Semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12500108B2Dec 16, 2025
Bonding system and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47