Inventor

LEE HYUEKJAE

KR25 patents

⚠️ This page may combine multiple inventors who share the name “LEE HYUEKJAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HYUEKJAE

SAMSUNG ELECTRONICS CO LTD

Semiconductor package including underfill material layer and method of forming the same

Die-to-wafer bonding structure and semiconductor package using the same

Semiconductor package having stacked semiconductor chips

Semiconductor package including a pad contacting a via

Die-to-wafer bonding structure and semiconductor package using the same

Semiconductor package having stacked semiconductor chips

Semiconductor packages having improved reliability in bonds between connection conductors and pads

Integrated circuit chip having BS-PDN structure

Semiconductor package

Semiconductor package

Packaged multi-chip semiconductor devices and methods of fabricating same

Stacked semiconductor package

Semiconductor package

Semiconductor package

Packaged multi-chip semiconductor devices and methods of fabricating same

Stacked semiconductor package

Semiconductor package and a method for manufacturing the same

Semiconductor package including underfill material layer and method of forming the same

Semiconductor package and a method for manufacturing the same

Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same

Semiconductor device and method of fabricating the same

Semiconductor package

Semiconductor package with bonding interface

KWON WOONSEONG

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

HONG JISUN

Method for wafer level package and semiconductor device fabricated using the same