Inventor

LEE YONGKWAN

KR26 patents

⚠️ This page may combine multiple inventors who share the name “LEE YONGKWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE YONGKWAN

SAMSUNG ELECTRONICS CO LTD

Semiconductor package

Semiconductor module adapted to be inserted into connector of external device

Semiconductor package for discharging heat generated by semiconductor chip

Semiconductor package for discharging heat generated by semiconductor chip

Interposer and semiconductor package including the same

Interposer and semiconductor package including the same

Semiconductor package having package substrate

Semiconductor package

Semiconductor package

Semiconductor package

Semiconductor package

Methods of manufacturing semiconductor package and package-on-package

Semiconductor package including electromagnetic shield structure

Package substrate and semiconductor package including the same

Semiconductor package

Semiconductor packages having fixing members

Semiconductor package

Interposers and semiconductor packages including the same

Interposer and semiconductor package including the same

Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses

Semiconductor package including a metal plate and package-on-package having the same

Semiconductor package

Molded product for semiconductor strip and method of manufacturing semiconductor package

Semiconductor package

Apparatus for conducting plasma surface treatment, board treatment system having the same

SEMES CO LTD

Antenna structure and plasma generating device