Inventor
YAMAKAWA JUNITSU
JP14 patents
Patents
14 patentsUS6379520B1Apr 30, 2002
Plating apparatus
EBARA CORP40 citations92
US6365017B1Apr 2, 2002
Substrate plating device
EBARA CORP31 citations92
US6627066B1Sep 30, 2003
Method of measuring the concentration of a leveler in a plating liquid
EBARA CORP22 citations91
US6793794B2Sep 21, 2004
Substrate plating apparatus and method
EBARA CORP7 citations73
USRE39123EJun 13, 2006
Plating apparatus
EBARA CORP3 citations62
US11015261B2May 25, 2021
Substrate holder and plating apparatus
EBARA CORP0 citations61
US11781233B2Oct 10, 2023
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
EBARA CORP0 citations58
US11767606B2Sep 26, 2023
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
EBARA CORP0 citations58
US11230780B2Jan 25, 2022
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
EBARA CORP0 citations58
US10991605B2Apr 27, 2021
Substrate processing device, method for controlling substrate processing device, and storage medium storing a program
EBARA CORP0 citations51
US10163672B2Dec 25, 2018
Substrate processing device, method for controlling substrate processing device, and storage medium storing programs
EBARA CORP0 citations51
US11600514B2Mar 7, 2023
Substrate holding device
EBARA CORP0 citations50
US10781530B2Sep 22, 2020
Cleaning apparatus, plating apparatus using the same, and cleaning method
EBARA CORP0 citations50
US7172683B2Feb 6, 2007
Method of managing a plating liquid used in a plating apparatus
EBARA CORP1 citations50