Inventor
Chi Yen-Yao
TW14 patents
⚠️ This page may combine multiple inventors who share the name “Chi Yen-Yao”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
11 patentsUS11081453B2Aug 3, 2021
Semiconductor package structure with antenna
MEDIATEK INC6 citations84
US11043730B2Jun 22, 2021
Fan-out package structure with integrated antenna
MEDIATEK INC5 citations84
US11742564B2Aug 29, 2023
Fan-out package structure with integrated antenna
MEDIATEK INC2 citations73
US11574881B2Feb 7, 2023
Semiconductor package structure with antenna
MEDIATEK INC2 citations73
US11450606B2Sep 20, 2022
Chip scale package structure and method of forming the same
MEDIATEK INC3 citations73
US11024954B2Jun 1, 2021
Semiconductor package with antenna and fabrication method thereof
MEDIATEK INC5 citations73
US11824020B2Nov 21, 2023
Semiconductor package structure including antenna
MEDIATEK INC0 citations62
US11791266B2Oct 17, 2023
Chip scale package structure and method of forming the same
MEDIATEK INC0 citations62
US11652273B2May 16, 2023
Innovative air gap for antenna fan out package
MEDIATEK INC1 citations62
US11508678B2Nov 22, 2022
Semiconductor package structure including antenna
MEDIATEK INC1 citations62
US11854784B2Dec 26, 2023
Chip scale package structure and method of forming the same
MEDIATEK INC0 citations52
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS9508664B1Nov 29, 2016
Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations92
US10163817B2Dec 25, 2018
Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US10943873B2Mar 9, 2021
Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62