Inventor
TUSTANIWSKYJ JERRY I
US13 patents
⚠️ This page may combine multiple inventors who share the name “TUSTANIWSKYJ JERRY I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNISYS CORP
12 patentsUS5019943AMay 28, 1991
High density chip stack having a zigzag-shaped face which accommodates connections between chips
UNISYS CORP159 citations96
US4879629ANov 7, 1989
Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation
UNISYS CORP70 citations94
US4721996AJan 26, 1988
Spring loaded module for cooling integrated circuit packages directly with a liquid
UNISYS CORP68 citations94
US4698728AOct 6, 1987
Leak tolerant liquid cooling system
UNISYS CORP91 citations94
US5579205ANov 26, 1996
Electromechanical module with post-solder attachable/removable heat sink frame and low profile
UNISYS CORP37 citations90
US4893499AJan 16, 1990
Method and apparatus for detecting leaks in IC packages by sensing package deflections
UNISYS CORP44 citations90
US5307239AApr 26, 1994
Electromechanical module with small footprint and post-solder attachable/removable heat sink frame
UNISYS CORP38 citations89
US4809134AFeb 28, 1989
Low stress liquid cooling assembly
UNISYS CORP31 citations89
US5441195AAug 15, 1995
Method of stretching solder joints
UNISYS CORP22 citations86
US4807019AFeb 21, 1989
Cavity-up-cavity-down multichip integrated circuit package
UNISYS CORP17 citations73
US4677370AJun 30, 1987
Method of testing wire bonds for defects using a magnetic field
UNISYS CORP12 citations72
US5424580AJun 13, 1995
Electro-mechanical assembly of high power and low power IC packages with a shared heat sink
UNISYS CORP17 citations71