Inventor
STRANDBERG JAN I
US9 patents
⚠️ This page may combine multiple inventors who share the name “STRANDBERG JAN I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KULICKE & SOFFA HOLDINGS INC
7 patentsUS6586682B2Jul 1, 2003
Printed wiring board with controlled line impedance
KULICKE & SOFFA HOLDINGS INC119 citations96
US6165892ADec 26, 2000
Method of planarizing thin film layers deposited over a common circuit base
KULICKE & SOFFA HOLDINGS INC60 citations92
US6509529B2Jan 21, 2003
Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch
KULICKE & SOFFA HOLDINGS INC17 citations91
US6323435B1Nov 27, 2001
Low-impedance high-density deposited-on-laminate structures having reduced stress
KULICKE & SOFFA HOLDINGS INC47 citations91
US6203967B1Mar 20, 2001
Method for controlling stress in thin film layers deposited over a high density interconnect common circuit base
KULICKE & SOFFA HOLDINGS INC29 citations90
US6440641B1Aug 27, 2002
Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates
KULICKE & SOFFA HOLDINGS INC29 citations89
US6299053B1Oct 9, 2001
Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch
KULICKE & SOFFA HOLDINGS INC14 citations72
KULICKE & SOFFA INVESTMENTS
2 patentsUS6953999B2Oct 11, 2005
High density chip level package for the packaging of integrated circuits and method to manufacture same
KULICKE & SOFFA INVESTMENTS35 citations88
US6872589B2Mar 29, 2005
High density chip level package for the packaging of integrated circuits and method to manufacture same
KULICKE & SOFFA INVESTMENTS31 citations88