Inventor
TAKEUCHI YUKIHARU
JP28 patents
⚠️ This page may combine multiple inventors who share the name “TAKEUCHI YUKIHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
23 patentsUS7279771B2Oct 9, 2007
Wiring board mounting a capacitor
SHINKO ELECTRIC IND CO86 citations97
US7723838B2May 25, 2010
Package structure having semiconductor device embedded within wiring board
SHINKO ELECTRIC IND CO87 citations96
US6093476AJul 25, 2000
Wiring substrate having vias
SHINKO ELECTRIC IND CO69 citations96
US6271478B1Aug 7, 2001
Multi-layer circuit board
SHINKO ELECTRIC IND CO35 citations92
US6194668B1Feb 27, 2001
Multi-layer circuit board
SHINKO ELECTRIC IND CO49 citations92
US5997999ADec 7, 1999
Sintered body for manufacturing ceramic substrate
SHINKO ELECTRIC IND CO32 citations92
US5497030AMar 5, 1996
Lead frame and resin-molded-type semiconductor device
SHINKO ELECTRIC IND CO36 citations92
US5229213AJul 20, 1993
Aluminum nitride circuit board
SHINKO ELECTRIC IND CO30 citations92
US7843059B2Nov 30, 2010
Electronic parts packaging structure
SHINKO ELECTRIC IND CO28 citations91
US7791206B2Sep 7, 2010
Semiconductor device and method of manufacturing the same
SHINKO ELECTRIC IND CO42 citations91
US9490221B2Nov 8, 2016
Semiconductor device having multiple magnetic shield members
SHINKO ELECTRIC IND CO8 citations84
US6221749B1Apr 24, 2001
Semiconductor device and production thereof
SHINKO ELECTRIC IND CO15 citations84
US8729680B2May 20, 2014
Semiconductor device
SHINKO ELECTRIC IND CO11 citations81
US8373997B2Feb 12, 2013
Semiconductor device
SHINKO ELECTRIC IND CO7 citations81
US5919546AJul 6, 1999
Porous ceramic impregnated wiring body
SHINKO ELECTRIC IND CO16 citations74
US5744224AApr 28, 1998
Board for mounting semiconductor chip
SHINKO ELECTRIC IND CO12 citations74
US5733640AMar 31, 1998
Fired body for manufacturing a substrate
SHINKO ELECTRIC IND CO9 citations74
US7788061B2Aug 31, 2010
Substrate and mask aligning apparatus
SHINKO ELECTRIC IND CO3 citations63
US6534846B1Mar 18, 2003
Lead frame for semiconductor device and semiconductor device using same
SHINKO ELECTRIC IND CO2 citations63
US7816177B2Oct 19, 2010
Semiconductor device and method of manufacturing the same
SHINKO ELECTRIC IND CO5 citations61
US8053677B2Nov 8, 2011
Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same
SHINKO ELECTRIC IND CO0 citations52
US6429517B1Aug 6, 2002
Semiconductor device and fabrication method thereof
SHINKO ELECTRIC IND CO1 citations52
US8853841B2Oct 7, 2014
Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same
SHINKO ELECTRIC IND CO0 citations42