Inventor
AKIGUCHI TAKASHI
JP9 patents
Patents
9 patentsUS6780668B1Aug 24, 2004
Package of semiconductor device and method of manufacture thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD56 citations95
US6086441AJul 11, 2000
Method for connecting electrodes of plasma display panel
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD62 citations95
US5744382AApr 28, 1998
Method of packaging electronic chip component and method of bonding of electrode thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD55 citations95
US7090482B2Aug 15, 2006
Semiconductor device package manufacturing method and semiconductor device package manufactured by the method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations92
US5646439AJul 8, 1997
Electronic chip component with passivation film and organic protective film
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD33 citations92
US5427642AJun 27, 1995
Method for mounting electronic parts on a printed circuit board by use of an adhesive composition
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD33 citations92
US5137936AAug 11, 1992
Method for packaging electronic parts and adhesive for use in said method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD42 citations91
US6708401B2Mar 23, 2004
Method of manufacturing article having electronic circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD15 citations84
US6357106B1Mar 19, 2002
Method for mounting parts and making an IC card
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5 citations62