Inventor
MIYAKAWA HIDENORI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “MIYAKAWA HIDENORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PANASONIC CORP
7 patentsUS7935892B2May 3, 2011
Electronic circuit device and method for manufacturing same
PANASONIC CORP14 citations84
US8378472B2Feb 19, 2013
Mounting structure for semiconductor element with underfill resin
PANASONIC CORP7 citations83
US7785500B2Aug 31, 2010
Electrically conductive adhesive
PANASONIC CORP9 citations82
US8344268B2Jan 1, 2013
Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same
PANASONIC CORP4 citations59
US8697237B2Apr 15, 2014
Thermosetting resin composition, method of manufacturing the same and circuit board
PANASONIC CORP0 citations51
US8345444B2Jan 1, 2013
Structure with electronic component mounted therein and method for manufacturing such structure
PANASONIC CORP0 citations51
US8012379B2Sep 6, 2011
Electroconductive bonding material and electric/electronic device using the same
PANASONIC CORP0 citations50
YAMAGUCHI ATSUSHI
4 patentsUS8410377B2Apr 2, 2013
Mounted structure
YAMAGUCHI ATSUSHI3 citations62
US8293370B2Oct 23, 2012
Bonding material, bonded portion and circuit board
YAMAGUCHI ATSUSHI3 citations62
US8217275B2Jul 10, 2012
Sealing material and mounting method using the sealing material
YAMAGUCHI ATSUSHI2 citations56
US8679635B2Mar 25, 2014
Bonding material, bonded portion and circuit board
YAMAGUCHI ATSUSHI1 citations52
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
3 patentsUS6780668B1Aug 24, 2004
Package of semiconductor device and method of manufacture thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD56 citations95
US7090482B2Aug 15, 2006
Semiconductor device package manufacturing method and semiconductor device package manufactured by the method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations92
US6708401B2Mar 23, 2004
Method of manufacturing article having electronic circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD15 citations84
KUWABARA RYO
3 patentsUS9072204B2Jun 30, 2015
Electronic module and production method therefor
KUWABARA RYO1 citations48
US8482931B2Jul 9, 2013
Package structure
KUWABARA RYO0 citations37
US8481629B2Jul 9, 2013
Surface mount adhesive, mounting structure including the same, and method for producing mounting structure
KUWABARA RYO0 citations36
OHASHI NAOMICHI
2 patentsPANASONIC IP MAN CO LTD
2 patentsUS11293583B2Apr 5, 2022
Heat-insulation material, heat-insulation structure using same, and process for producing same
PANASONIC IP MAN CO LTD0 citations59
US10407604B2Sep 10, 2019
Heat-dissipating resin composition, and component and electronic device including the same
PANASONIC IP MAN CO LTD0 citations49