Inventor

KUAN LEE CHOON

SG20 patents

⚠️ This page may combine multiple inventors who share the name “KUAN LEE CHOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUAN LEE CHOON

MICRON TECHNOLOGY INC

Temporary, conformable contacts for microelectronic components

BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die

Semiconductor component having multi layered leadframe

Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods

Method for fabricating semiconductor component with multi layered leadframe

Method for fabricating semiconductor component with chip on board leadframe

Semiconductor component having chip on board leadframe

Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies

Bow control in an electronic package

Bow control in an electronic package

Method for fabricating a semiconductor package with multi layered leadframe

Build-up-package for integrated circuit devices, and methods of making same

Carrierless chip package for integrated circuit devices, and methods of making same

Semiconductor device assemblies including face-to-face semiconductor dice and related methods

Bow control in an electronic package

Chip on board leadframe for semiconductor components having area array

Land grid array semiconductor device packages

CORISIS DAVID J

Semiconductor device packages and assemblies

Carrierless chip package for integrated circuit devices, and methods of making same

WANG LOW PENG

Apparatus and methods for forming wire bonds