Inventor
LAI LEE WANG
SG7 patents
⚠️ This page may combine multiple inventors who share the name “LAI LEE WANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
6 patentsUS6784525B2Aug 31, 2004
Semiconductor component having multi layered leadframe
MICRON TECHNOLOGY INC44 citations95
US7205656B2Apr 17, 2007
Stacked device package for peripheral and center device pad layout device
MICRON TECHNOLOGY INC58 citations94
US6835599B2Dec 28, 2004
Method for fabricating semiconductor component with multi layered leadframe
MICRON TECHNOLOGY INC29 citations92
US6972214B2Dec 6, 2005
Method for fabricating a semiconductor package with multi layered leadframe
MICRON TECHNOLOGY INC10 citations73
US7846768B2Dec 7, 2010
Stacked die package for peripheral and center device pad layout device
MICRON TECHNOLOGY INC5 citations72
US7425463B2Sep 16, 2008
Stacked die package for peripheral and center device pad layout device
MICRON TECHNOLOGY INC7 citations72