Inventor
DATTA MADHAV
US49 patents
⚠️ This page may combine multiple inventors who share the name “DATTA MADHAV”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
34 patentsUS6103096AAug 15, 2000
Apparatus and method for the electrochemical etching of a wafer
IBM219 citations99
US5567300AOct 22, 1996
Electrochemical metal removal technique for planarization of surfaces
IBM370 citations99
US5543032AAug 6, 1996
Electroetching method and apparatus
IBM162 citations99
US5217586AJun 8, 1993
Electrochemical tool for uniform metal removal during electropolishing
IBM255 citations99
US6224690B1May 1, 2001
Flip-Chip interconnections using lead-free solders
IBM191 citations98
US5937320AAug 10, 1999
Barrier layers for electroplated SnPb eutectic solder joints
IBM297 citations98
US5558957ASep 24, 1996
Method for making a thin flexible primary battery for microelectronics applications
IBM108 citations98
US5567304AOct 22, 1996
Elimination of island formation and contact resistance problems during electroetching of blanket or patterned thin metallic layers on insulating substrate
IBM54 citations96
US5462638AOct 31, 1995
Selective etching of TiW for C4 fabrication
IBM82 citations96
US5284554AFeb 8, 1994
Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
IBM57 citations96
US5268072ADec 7, 1993
Etching processes for avoiding edge stress in semiconductor chip solder bumps
IBM119 citations96
US5486282AJan 23, 1996
Electroetching process for seed layer removal in electrochemical fabrication of wafers
IBM88 citations95
US5066370ANov 19, 1991
Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands
IBM56 citations94
US6030728AFeb 29, 2000
High performance lithium polymer electrolyte battery
IBM43 citations93
US5989751ANov 23, 1999
High energy density, flexible lithium primary batteries
IBM39 citations93
US5939223AAug 17, 1999
Lithium polymer electrolyte battery for sub-ambient temperature applications
IBM22 citations92
US5865984AFeb 2, 1999
Electrochemical etching apparatus and method for spirally etching a workpiece
IBM60 citations92
US5800726ASep 1, 1998
Selective chemical etching in microelectronics fabrication
IBM45 citations92
US5456788AOct 10, 1995
Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process
IBM25 citations92
US5445705AAug 29, 1995
Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process
IBM22 citations92
US5105537AApr 21, 1992
Method for making a detachable electrical contact
IBM25 citations92
US5759437AJun 2, 1998
Etching of Ti-W for C4 rework
IBM20 citations91
US5536388AJul 16, 1996
Vertical electroetch tool nozzle and method
IBM42 citations91
US5796168AAug 18, 1998
Metallic interconnect pad, and integrated circuit structure using same, with reduced undercut
IBM30 citations90
US5614076AMar 25, 1997
Tool and method for electroetching
IBM33 citations89
US5531874AJul 2, 1996
Electroetching tool using localized application of channelized flow of electrolyte
IBM29 citations89
US5152878AOct 6, 1992
Method for electrochemical cleaning of metal residue on molybdenum masks
IBM29 citations86
US6656750B1Dec 2, 2003
Method for testing chips on flat solder bumps
IBM17 citations84
US5620611AApr 15, 1997
Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads
IBM16 citations81
US5476575ADec 19, 1995
Fabrication of moly masks by electroetching
IBM19 citations77
US6258703B1Jul 10, 2001
Reflow of low melt solder tip C4's
IBM8 citations74
US5190463AMar 2, 1993
High performance metal cone contact
IBM15 citations74
US6228246B1May 8, 2001
Removal of metal skin from a copper-Invar-copper laminate
IBM7 citations73
US6238589B1May 29, 2001
Methods for monitoring components in the TiW etching bath used in the fabrication of C4s
IBM14 citations70
INTEL CORP
11 patentsUS6853076B2Feb 8, 2005
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
INTEL CORP203 citations97
US6977224B2Dec 20, 2005
Method of electroless introduction of interconnect structures
INTEL CORP50 citations96
US6917106B2Jul 12, 2005
Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps
INTEL CORP46 citations96
US6696758B2Feb 24, 2004
Interconnect structures and a method of electroless introduction of interconnect structures
INTEL CORP57 citations96
US7196001B2Mar 27, 2007
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
INTEL CORP34 citations95
US6750133B2Jun 15, 2004
Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps
INTEL CORP24 citations93
US6878465B2Apr 12, 2005
Under bump metallurgy for Lead-Tin bump over copper pad
INTEL CORP19 citations92
US6703069B1Mar 9, 2004
Under bump metallurgy for lead-tin bump over copper pad
INTEL CORP33 citations92
US7250678B2Jul 31, 2007
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
INTEL CORP10 citations83
US6740427B2May 25, 2004
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same
INTEL CORP13 citations81
US10037956B2Jul 31, 2018
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
INTEL CORP1 citations61
DATTA MADHAV
3 patentsUS8254422B2Aug 28, 2012
Microheat exchanger for laser diode cooling
DATTA MADHAV14 citations82
US8299604B2Oct 30, 2012
Bonded metal and ceramic plates for thermal management of optical and electronic devices
DATTA MADHAV3 citations61
US8952550B2Feb 10, 2015
Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
DATTA MADHAV2 citations60