Inventor

SUH DOOWON

US7 patents

⚠️ This page may combine multiple inventors who share the name “SUH DOOWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

5 patents

US6853076B2Feb 8, 2005

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

INTEL CORP203 citations97

US7196001B2Mar 27, 2007

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

INTEL CORP34 citations95

US7250678B2Jul 31, 2007

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

INTEL CORP10 citations83

US6740427B2May 25, 2004

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same

INTEL CORP13 citations81

US10037956B2Jul 31, 2018

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

INTEL CORP1 citations61

BERGMANN MICHAEL JOHN

1 patent

US9437785B2Sep 6, 2016

Light emitting diodes including integrated backside reflector and die attach

BERGMANN MICHAEL JOHN2 citations61

DATTA MADHAV

1 patent

US8952550B2Feb 10, 2015

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

DATTA MADHAV2 citations60