Inventor
KAWAI TOSHIYASU
JP9 patents
Patents
9 patentsUS6700185B1Mar 2, 2004
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device
HITACHI CHEMICAL CO LTD28 citations92
US6462148B1Oct 8, 2002
Adhesive film of quinoline polymer and bismaleimide
HITACHI CHEMICAL CO LTD23 citations92
US5583191ADec 10, 1996
Plastic lens
HITACHI CHEMICAL CO LTD21 citations91
US7449367B2Nov 11, 2008
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device
HITACHI CHEMICAL CO LTD9 citations83
US7479412B2Jan 20, 2009
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
HITACHI CHEMICAL CO LTD6 citations73
US7378722B2May 27, 2008
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
HITACHI CHEMICAL CO LTD6 citations73
US7057266B2Jun 6, 2006
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
HITACHI CHEMICAL CO LTD9 citations73
US5663264ASep 2, 1997
Transparent resin and plastic lens
HITACHI CHEMICAL CO LTD11 citations72
US7843045B2Nov 30, 2010
Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device
HITACHI CHEMICAL CO LTD5 citations57