Inventor
WANG YAXIN
US33 patents
⚠️ This page may combine multiple inventors who share the name “WANG YAXIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS6624064B1Sep 23, 2003
Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application
APPLIED MATERIALS INC583 citations99
US6070551AJun 6, 2000
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC135 citations99
US7473655B2Jan 6, 2009
Method for silicon based dielectric chemical vapor deposition
APPLIED MATERIALS INC430 citations98
US6833052B2Dec 21, 2004
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC65 citations96
US6589610B2Jul 8, 2003
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC53 citations96
US6475854B2Nov 5, 2002
Method of forming metal electrodes
APPLIED MATERIALS INC159 citations96
US6416823B2Jul 9, 2002
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC61 citations96
US6383954B1May 7, 2002
Process gas distribution for forming stable fluorine-doped silicate glass and other films
APPLIED MATERIALS INC90 citations96
US6323119B1Nov 27, 2001
CVD deposition method to improve adhesion of F-containing dielectric metal lines for VLSI application
APPLIED MATERIALS INC59 citations96
US6440495B1Aug 27, 2002
Chemical vapor deposition of ruthenium films for metal electrode applications
APPLIED MATERIALS INC136 citations95
US6211065B1Apr 3, 2001
Method of depositing and amorphous fluorocarbon film using HDP-CVD
APPLIED MATERIALS INC100 citations95
US6479100B2Nov 12, 2002
CVD ruthenium seed for CVD ruthenium deposition
APPLIED MATERIALS INC61 citations94
US6511923B1Jan 28, 2003
Deposition of stable dielectric films
APPLIED MATERIALS INC42 citations92
US6413871B2Jul 2, 2002
Nitrogen treatment of polished halogen-doped silicon glass
APPLIED MATERIALS INC40 citations92
US6814814B2Nov 9, 2004
Cleaning residues from surfaces in a chamber by sputtering sacrificial substrates
APPLIED MATERIALS INC22 citations91
US7413627B2Aug 19, 2008
Deposition chamber and method for depositing low dielectric constant films
APPLIED MATERIALS INC6 citations74
US7542132B2Jun 2, 2009
Raman spectroscopy as integrated chemical metrology
APPLIED MATERIALS INC7 citations71
US7910476B2Mar 22, 2011
Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop
APPLIED MATERIALS INC3 citations62
NOBELL FOODS INC
4 patentsUS11840717B2Dec 12, 2023
Host cells comprising a recombinant casein protein and a recombinant kinase protein
NOBELL FOODS INC6 citations84
US12241109B2Mar 4, 2025
Host cells comprising a recombinant casein protein and a recombinant kinase protein
NOBELL FOODS INC0 citations61
US12139737B2Nov 12, 2024
Host cells comprising a recombinant casein protein and a recombinant kinase protein
NOBELL FOODS INC0 citations61
US12148506B2Nov 19, 2024
Compositions and methods for expressing genes of interest in host cells
NOBELL FOODS INC0 citations50
HUAWEI TECH CO LTD
4 patentsUS12401975B2Aug 26, 2025
Communication method, apparatus, and system
HUAWEI TECH CO LTD2 citations75
US11979247B2May 7, 2024
Message forwarding method and apparatus
HUAWEI TECH CO LTD0 citations63
US12593077B2Mar 31, 2026
Media stream switching method and apparatus
HUAWEI TECH CO LTD0 citations62
US12574822B2Mar 10, 2026
Method for determining MEC access point and apparatus
HUAWEI TECH CO LTD0 citations52
LAM RES CORP
4 patentsUS8603913B1Dec 10, 2013
Porous dielectrics K value restoration by thermal treatment and or solvent treatment
LAM RES CORP3 citations61
US9818617B2Nov 14, 2017
Method of electroless plating using a solution with at least two borane containing reducing agents
LAM RES CORP0 citations48
US9551074B2Jan 24, 2017
Electroless plating solution with at least two borane containing reducing agents
LAM RES CORP0 citations48
US9142416B1Sep 22, 2015
Process to reduce nodule formation in electroless plating
LAM RES CORP0 citations48