Inventor
DOURIET DANIEL
US18 patents
⚠️ This page may combine multiple inventors who share the name “DOURIET DANIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS7467050B2Dec 16, 2008
Method for detecting noise events in systems with time variable operating points
IBM16 citations92
US6993739B2Jan 31, 2006
Method, structure, and computer program product for implementing high frequency return current paths within electronic packages
IBM23 citations91
US7765504B2Jul 27, 2010
Design method and system for minimizing blind via current loops
IBM15 citations84
US7607028B2Oct 20, 2009
Mitigate power supply noise response by throttling execution units based upon voltage sensing
IBM9 citations84
US7863724B2Jan 4, 2011
Circuit substrate having post-fed die side power supply connections
IBM11 citations82
US7272809B2Sep 18, 2007
Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design
IBM11 citations82
US7376914B2May 20, 2008
Method and computer program product for designing power distribution system in a circuit
IBM4 citations63
US7920978B2Apr 5, 2011
Method for detecting noise events in systems with time variable operating points
IBM2 citations62
US7614141B2Nov 10, 2009
Fabricating substrates having low inductance via arrangements
IBM2 citations62
US7275222B2Sep 25, 2007
Method, apparatus, and computer program product for enhancing a power distribution system in a ceramic integrated circuit package
IBM5 citations62
US7460986B2Dec 2, 2008
System DC Analysis Methodology
IBM2 citations61
US7671273B2Mar 2, 2010
Method and apparatus for facilitating signal transmission using differential transmission lines
IBM4 citations58
US7469199B2Dec 23, 2008
Apparatus and method for selectively monitoring multiple voltages in an IC or other electronic chip
IBM1 citations52
US8055486B2Nov 8, 2011
Power delivery analysis and design
IBM0 citations51
US7917870B2Mar 29, 2011
Enhancing a power distribution system in a ceramic integrated circuit package
IBM0 citations51
US8722536B2May 13, 2014
Fabrication method for circuit substrate having post-fed die side power supply connections
IBM0 citations50