Inventor
KRAFT ROBERT
US40 patents
⚠️ This page may combine multiple inventors who share the name “KRAFT ROBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
24 patentsUS6136654AOct 24, 2000
Method of forming thin silicon nitride or silicon oxynitride gate dielectrics
TEXAS INSTRUMENTS INC207 citations98
US5796151AAug 18, 1998
Semiconductor stack having a dielectric sidewall for prevention of oxidation of tungsten in tungsten capped poly-silicon gate electrodes
TEXAS INSTRUMENTS INC112 citations98
US6362111B1Mar 26, 2002
Tunable gate linewidth reduction process
TEXAS INSTRUMENTS INC88 citations93
US6261934B1Jul 17, 2001
Dry etch process for small-geometry metal gates over thin gate dielectric
TEXAS INSTRUMENTS INC39 citations93
US7442597B2Oct 28, 2008
Systems and methods that selectively modify liner induced stress
TEXAS INSTRUMENTS INC18 citations92
US6607985B1Aug 19, 2003
Gate stack and etch process
TEXAS INSTRUMENTS INC22 citations92
US6399445B1Jun 4, 2002
Fabrication technique for controlled incorporation of nitrogen in gate dielectric
TEXAS INSTRUMENTS INC51 citations92
US6984580B2Jan 10, 2006
Dual damascene pattern liner
TEXAS INSTRUMENTS INC29 citations91
US6797633B2Sep 28, 2004
In-situ plasma ash/treatment after via etch of low-k films for poison-free dual damascene trench patterning
TEXAS INSTRUMENTS INC27 citations90
US6780756B1Aug 24, 2004
Etch back of interconnect dielectrics
TEXAS INSTRUMENTS INC27 citations90
US6214736B1Apr 10, 2001
Silicon processing method
TEXAS INSTRUMENTS INC20 citations89
US7119006B2Oct 10, 2006
Via formation for damascene metal conductors in an integrated circuit
TEXAS INSTRUMENTS INC16 citations84
US6900123B2May 31, 2005
BARC etch comprising a selective etch chemistry and a high polymerizing gas for CD control
TEXAS INSTRUMENTS INC12 citations84
US7300883B2Nov 27, 2007
Method for patterning sub-lithographic features in semiconductor manufacturing
TEXAS INSTRUMENTS INC8 citations69
US7282436B2Oct 16, 2007
Plasma treatment for silicon-based dielectrics
TEXAS INSTRUMENTS INC4 citations62
US7985603B2Jul 26, 2011
Ferroelectric capacitor manufacturing process
TEXAS INSTRUMENTS INC4 citations61
US7678713B2Mar 16, 2010
Energy beam treatment to improve packaging reliability
TEXAS INSTRUMENTS INC4 citations60
US7341941B2Mar 11, 2008
Methods to facilitate etch uniformity and selectivity
TEXAS INSTRUMENTS INC2 citations60
US6872665B1Mar 29, 2005
Process flow for dual damescene interconnect structures
TEXAS INSTRUMENTS INC3 citations58
US7687407B2Mar 30, 2010
Method for reducing line edge roughness for conductive features
TEXAS INSTRUMENTS INC2 citations56
US7939400B2May 10, 2011
Systems and methods that selectively modify liner induced stress
TEXAS INSTRUMENTS INC0 citations51
US7723199B2May 25, 2010
Method for cleaning post-etch noble metal residues
TEXAS INSTRUMENTS INC0 citations51
US7682989B2Mar 23, 2010
Formation of a silicon oxide interface layer during silicon carbide etch stop deposition to promote better dielectric stack adhesion
TEXAS INSTRUMENTS INC0 citations46
US7087518B2Aug 8, 2006
Method of passivating and/or removing contaminants on a low-k dielectric/copper surface
TEXAS INSTRUMENTS INC0 citations46
QORVO US INC
7 patentsUS12365979B2Jul 22, 2025
Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same
QORVO US INC1 citations73
US11824511B2Nov 21, 2023
Method for manufacturing piezoelectric bulk layers with tilted c-axis orientation
QORVO US INC2 citations72
US10367470B2Jul 30, 2019
Wafer-level-packaged BAW devices with surface mount connection structures
QORVO US INC2 citations69
US12597902B2Apr 7, 2026
Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same
QORVO US INC0 citations62
US11381212B2Jul 5, 2022
Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same
QORVO US INC0 citations62
US11885007B2Jan 30, 2024
Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same
QORVO US INC0 citations61
US11401601B2Aug 2, 2022
Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same
QORVO US INC0 citations61