Inventor

HATTORI TAKAHIRO

JP23 patents

⚠️ This page may combine multiple inventors who share the name “HATTORI TAKAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HATTORI TAKAHIRO

SENJU METAL INDUSTRY CO

Cu ball

Bump electrode, board which has bump electrodes, and method for manufacturing the board

Cu core ball, solder paste, formed solder, Cu core column, and solder joint

Solder alloy, solder ball, chip solder, solder paste and solder joint

Solder material, solder paste, solder preform, solder joint and method of managing the solder material

Method for forming bump electrode substrate

Core material, semiconductor package, and forming method of bump electrode

Solder alloy, solder ball, chip solder, solder paste, and solder joint

Flux composition for solder applications

CHISSO CORP

Method for producing reinforced thermoplastic resin composition and melt-kneading apparatus

Process for the preparation of fiber-filled thermoplastic resin composition

Heat-sensitive recording material

TOYO BOSEKI

Fabric for airbag

Woven fabric for airbag

Adhesive resin composition and adhesive film

NEC CORP

Operational amplifier circuit

D/A converter

NAKAGAWA AIRI

Bus bar, motor, and process for producing these

NIDEC CORP

Resolver, manufacturing method thereof, and motor using the resolver

KIRA MACHINERY CO LTD

Turret head unit

NICHIHA KK

Building material manufacturing apparatus

HAGIWARA HIROAKI

Copolymerized polyether polyamide resin

HATTORI TAKAHIRO

Signboard device