Inventor

BAO XUSHENG

SG20 patents

⚠️ This page may combine multiple inventors who share the name “BAO XUSHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAO XUSHENG

STATS CHIPPAC LTD

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Semiconductor device and method of forming insulating layer around semiconductor die

Semiconductor device and method of forming insulating layer around semiconductor die

Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration

Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP

LIN YAOJIAN

Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP

Semiconductor device and method of forming insulating layer around semiconductor die

CHOW SENG GUAN

Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region

Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package

BAO XUSHENG

Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration

Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump

CHEN KANG

Integrated circuit packaging system with active surface heat removal and method of manufacture thereof

HSIAO YUNG KUAN

Integrated circuit packaging system with warpage control and method of manufacture thereof

GOH HIN HWA

Integrated circuit packaging system with warpage control and method of manufacture thereof

HUANG RUI

Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof

JCET SEMICONDUCTOR SHAOXING CO LTD

Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)

JANG TAEHOAN

Semiconductor device and method of forming interconnect structure in non-active area of wafer