Inventor

JEON HYUNG-JUN

KR19 patents

⚠️ This page may combine multiple inventors who share the name “JEON HYUNG-JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JEON HYUNG-JUN

STATS CHIPPAC LTD

Method of fabricating a shielded stacked integrated circuit package system

Shielded stacked integrated circuit packaging system and method of manufacture thereof

Integrated circuit underfill package system

Integrated circuit underfill package system

Shielded stacked integrated circuit packaging system and method of manufacture thereof

Integrated circuit package system

SAMSUNG ELECTRONICS CO LTD

Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same

Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices

Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices

Semiconductor device and method for fabricating the same

Wafer bonding apparatuses

CHOI HEON SOO

Method and apparatus for detecting offset signal of transmission leakage signal in RF transceiver

Vector modulator using time delay and phase shifter

Vector modulator

HONG JIN KUK

Reader based on RFID

Gate system

JEON HYUNG JUN

Semiconductor wafer scale package system

Integrated circuit package system and method of manufacture thereof

KIM JONG-SEOK

Apparatus and method for connecting access point in portable terminal