Inventor

FENG XIA

CN33 patents

⚠️ This page may combine multiple inventors who share the name “FENG XIA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FENG XIA

STATS CHIPPAC LTD

Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis

Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer

Semiconductor device and method of forming insulating layer around semiconductor die

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Semiconductor device and method of forming insulating layer around semiconductor die

LIN YAOJIAN

Semiconductor device and method of forming interconnect substrate for FO-WLCSP

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Semiconductor device and method of forming insulating layer around semiconductor die

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis

Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch

Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer

BOE TECHNOLOGY GROUP CO LTD

Driving method of a liquid crystal display panel, a liquid crystal display panel and a display device

Driver integrated circuit for driving display panel, display device and method for driving driver integrated circuit capable of providing different current intensities to different length transmission wires

GOA circuit, array substrate, display device and driving method

GOA circuit, array substrate, and display device

Display panel and driving method therefor, and display apparatus

Printed circuit board and detection method for detecting connection between printed circuit board and flexible circuit board, and display panel

STATS CHIPPAC PTE LTD

Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

SEMICONDUCTOR MFG INT SHANGHAI CORP

Semiconductor structure and method of forming the same

Optical device and fabrication method thereof

JCET SEMICONDUCTOR SHAOXING CO LTD

Semiconductor device and method of forming interconnect substrate for FO-WLCSP

SEMICONDUCTOR MFG INT SHANGHAI

Image sensor device and method of manufacturing the same

FENG XIA

Light emitting device for a container