Inventor
BRUN XAVIER F
US7 patents
Patents
7 patentsUS9437468B2Sep 6, 2016
Heat assisted handling of highly warped substrates post temporary bonding
INTEL CORP6 citations81
US9620404B1Apr 11, 2017
Stiffener tape for electronic assembly that includes wafer or panel
INTEL CORP3 citations70
US12599050B2Apr 7, 2026
Multi-level die coupled with a substrate
INTEL CORP0 citations60
US11804470B2Oct 31, 2023
Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control
INTEL CORP0 citations58
US11705417B2Jul 18, 2023
Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level
INTEL CORP0 citations58
US8969134B2Mar 3, 2015
Laser ablation tape for solder interconnect formation
INTEL CORP2 citations56
US9698108B1Jul 4, 2017
Structures to mitigate contamination on a back side of a semiconductor substrate
INTEL CORP0 citations36