Inventor

OU SHENGQUAN E

US2 patents

⚠️ This page may combine multiple inventors who share the name “OU SHENGQUAN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHI HUALIANG

1 patent

US8970051B2Mar 3, 2015

Solution to deal with die warpage during 3D die-to-die stacking

SHI HUALIANG12 citations74

INTEL CORP

1 patent

US9698108B1Jul 4, 2017

Structures to mitigate contamination on a back side of a semiconductor substrate

INTEL CORP0 citations36