Inventor

LEE HUI-YU

TW67 patents

⚠️ This page may combine multiple inventors who share the name “LEE HUI-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HUI-YU

TAIWAN SEMICONDUCTOR MFG CO LTD

Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor

Multi-patterning system and method using pre-coloring or locked patterns

Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same

Directionally tunable optical reflector

Photonic heater

Heat dissipation structure including stacked chips surrounded by thermal interface material rings

Electromagnetic shielding metal-insulator-metal capacitor structure

Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same

Structure and method for cooling three-dimensional integrated circuits

Electromagnetic shielding metal-insulator-metal capacitor structure

Photonic heater

Interposer and semiconductor package with noise suppression features

Structure and method for cooling three-dimensional integrated circuits

Interposer and semiconductor package with noise suppression features

Solenoid inductors within a multi-chip package

Methods and systems to estimate power network noise

Integrated circuit design method and system with color-coded components

Method and system for verifying integrated circuit stack having photonic device

Method and system for verifying integrated circuit stack having photonic device

Directionally tunable optical reflector

Methods for making semiconductor-based integrated circuits

Structures and process flow for integrated photonic-electric ic package by using polymer waveguide

Photonic heater

Heat dissipation structures for three-dimensional system on integrated chip structure

Integrated circuit device and method

Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same

Directionally tunable optical reflector

Methods for making semiconductor-based integrated circuits

Semiconductor device including optical through via and method of making

Heat dissipation structures

Structures and process flow for integrated photonic-electric IC package by using polymer waveguide

Electromagnetic shielding metal-insulator-metal capacitor structure

Method of forming entangled inductor structures

Structure and method for cooling three-dimensional integrated circuits

Method for making a semiconductor device

Entangled inductor structures

Partitioning method and system for 3D IC

SOIC chip architecture

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG

Macro cell based process design kit for advanced applications

Integrated circuit design system with color-coded component loading estimate display

Method of reducing parasitic mismatch

Variation modeling

Method of radio-frequency and microwave device generation

Method and apparatus of a three dimensional integrated circuit

Method, system and computer program product for designing semiconductor device

LEE HUI YU

System and method for reducing layout-dependent effects

Method of performing circuit simulation and generating circuit layout

CHANG SHIH-CHENG

Method of creating spiral inductor having high Q value

ADVANCED SEMICONDUCTOR ENG

Semiconductor package structures and methods of manufacturing the same