Inventor
HEJASE JOSE A
US21 patents
Patents
21 patentsUS10135162B1Nov 20, 2018
Method for fabricating a hybrid land grid array connector
IBM8 citations82
US10128593B1Nov 13, 2018
Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body
IBM6 citations82
US11658378B2May 23, 2023
Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)
IBM4 citations72
US10141623B2Nov 27, 2018
Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
IBM2 citations71
US9638750B2May 2, 2017
Frequency-domain high-speed bus signal integrity compliance model
IBM2 citations71
US10167879B2Jan 1, 2019
Cooling fan coupled with a set of recirculation flaps
IBM2 citations69
US9368852B2Jun 14, 2016
Method for performing frequency band splitting
IBM2 citations61
US11399428B2Jul 26, 2022
PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication
IBM0 citations60
US10181628B2Jan 15, 2019
Reduction of crosstalk between dielectric waveguides using split ring resonators
IBM1 citations59
US12451448B2Oct 21, 2025
Electromagnetic waveguiding through liquid cooling conduit
IBM0 citations55
US10620253B2Apr 14, 2020
Noise modulation for on-chip noise measurement
IBM0 citations51
US9835665B2Dec 5, 2017
Noise modulation for on-chip noise measurement
IBM0 citations51
US9797938B2Oct 24, 2017
Noise modulation for on-chip noise measurement
IBM0 citations51
US12266598B2Apr 1, 2025
Dense via pitch interconnect to increase wiring density
IBM0 citations50
US9893400B2Feb 13, 2018
Method for performing frequency band splitting
IBM1 citations50
US9733305B2Aug 15, 2017
Frequency-domain high-speed bus signal integrity compliance model
IBM0 citations50
US9686053B2Jun 20, 2017
Frequency-domain high-speed bus signal integrity compliance model
IBM0 citations50
US9673941B2Jun 6, 2017
Frequency-domain high-speed bus signal integrity compliance model
IBM0 citations50
US10167878B2Jan 1, 2019
Cooling fan coupled with a set of recirculation flaps
IBM0 citations48
US10199706B2Feb 5, 2019
Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes
IBM0 citations40
US10879575B2Dec 29, 2020
Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures
IBM0 citations36