Inventor
ZHANG SAI
US28 patents
⚠️ This page may combine multiple inventors who share the name “ZHANG SAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLE INC
7 patentsUS11157109B1Oct 26, 2021
Touch sensing with water rejection
APPLE INC14 citations81
US11620021B1Apr 4, 2023
Methods and apparatus for cross-coupling correction on a touch sensor panel
APPLE INC3 citations72
US10831296B1Nov 10, 2020
Touch rejection for wet fabric
APPLE INC4 citations72
US11269457B1Mar 8, 2022
Systems and methods for improved touch screen selectivity and sensitivity
APPLE INC5 citations65
US12189899B2Jan 7, 2025
Touch sensing with water rejection
APPLE INC1 citations60
US10592027B2Mar 17, 2020
State-based touch threshold
APPLE INC1 citations60
US12197668B2Jan 14, 2025
Systems and methods for touch sensing on devices including regions with and without touch electrodes
APPLE INC0 citations57
TEXAS INSTRUMENTS INC
6 patentsUS10592333B2Mar 17, 2020
Dual-mode error-correction code/write-once memory codec
TEXAS INSTRUMENTS INC2 citations73
US9772899B2Sep 26, 2017
Error correction code management of write-once memory codes
TEXAS INSTRUMENTS INC2 citations73
US9690517B2Jun 27, 2017
Dual-mode error-correction code/write-once memory codec
TEXAS INSTRUMENTS INC4 citations73
US11016842B2May 25, 2021
Methods and apparatus to detect and correct errors in destructive read non-volatile memory
TEXAS INSTRUMENTS INC0 citations62
US10191801B2Jan 29, 2019
Error correction code management of write-once memory codes
TEXAS INSTRUMENTS INC0 citations52
US9715943B2Jul 25, 2017
Semiconductor memory cell multi-write avoidance encoding apparatus, systems and methods
TEXAS INSTRUMENTS INC0 citations41
GIGADEVICE SEMICONDUCTOR BEIJING INC
3 patentsUS9396798B2Jul 19, 2016
Enhanced flash chip and method for packaging chip
GIGADEVICE SEMICONDUCTOR BEIJING INC4 citations72
US9836236B2Dec 5, 2017
SPI interface enhanced flash chip and chip packaging method
GIGADEVICE SEMICONDUCTOR BEIJING INC2 citations70
US9728520B2Aug 8, 2017
Enhanced flash chip and method for packaging chip
GIGADEVICE SEMICONDUCTOR BEIJING INC1 citations49