Inventor

KASAI WATARU

JP20 patents

⚠️ This page may combine multiple inventors who share the name “KASAI WATARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KASAI WATARU

AGC INC

Mold release film, process for its production, and process for producing semiconductor package

Insulating tape for covering, and method for producing structure

Long laminate, method for its production and printed wiring board

Fluororesin film and laminate, and method for producing hot pressed laminate

Ethylene-tetrafluoroethylene copolymer film and method for producing same

Roll film, method for producing roll film, method for producing copper-clad laminate and method for producing printed board

Long film, method for producing long film, method for producing long multilayer body, and long multilayer body

Film, method for producing film, metal-clad laminate, and coated metal conductor

Molded product, metal-clad laminate, printed wiring board, and methods for their production

Film and method for its production

Adhesive film and flexible metal laminate

Process for producing package for mounting a semiconductor element and mold release film

Resin film and process for its production

Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit board

Process for producing laminate and process for producing printed board

ASAHI GLASS CO LTD

Film, method for its production, and method for producing semiconductor element using the film

Mold release film and process for producing semiconductor package

Mold release film and process for producing semiconductor package

Mold release film and method of process for producing a semiconductor device using the same

SPLINK INC

Diagnosis support system and method