Inventor
JUNG HYE-WON
KR7 patents
Patents
7 patentsUS9793250B2Oct 17, 2017
Package board, method for manufacturing the same and package on package having the same
SAMSUNG ELECTRO MECH3 citations71
US11315718B2Apr 26, 2022
Coil component and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations58
US10849226B2Nov 24, 2020
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations58
US10779409B2Sep 15, 2020
Printed circuit board
SAMSUNG ELECTRO MECH1 citations58
US10021785B2Jul 10, 2018
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations50
US9554466B2Jan 24, 2017
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations50
US11476034B2Oct 18, 2022
Coil electronic component
SAMSUNG ELECTRO MECH0 citations44