Inventor
SIM JAE-SUNG
KR30 patents
⚠️ This page may combine multiple inventors who share the name “SIM JAE-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS8004893B2Aug 23, 2011
Integrated circuit memory devices having vertically arranged strings of memory cells therein and methods of operating same
SAMSUNG ELECTRONICS CO LTD20 citations92
US8895393B2Nov 25, 2014
Memory devices including vertical pillars and methods of manufacturing and operating the same
SAMSUNG ELECTRONICS CO LTD9 citations84
US7812390B2Oct 12, 2010
Semiconductor memory device with memory cells on multiple layers
SAMSUNG ELECTRONICS CO LTD9 citations84
US7732856B2Jun 8, 2010
Charge-trap type non-volatile memory devices and related methods
SAMSUNG ELECTRONICS CO LTD10 citations84
US9385138B2Jul 5, 2016
Memory devices including vertical pillars and methods of manufacturing and operating the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US11152390B2Oct 19, 2021
Vertical semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US8018781B2Sep 13, 2011
Method of operating nonvolatile memory device
SAMSUNG ELECTRONICS CO LTD0 citations52
US7893484B2Feb 22, 2011
Semiconductor device with charge storage pattern and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7888219B2Feb 15, 2011
Methods of forming charge-trap type non-volatile memory devices
SAMSUNG ELECTRONICS CO LTD0 citations52
US7772639B2Aug 10, 2010
Charge-trap nonvolatile memory devices
SAMSUNG ELECTRONICS CO LTD0 citations52
US10700092B2Jun 30, 2020
Vertical semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US10367002B2Jul 30, 2019
Vertical semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
SAMSUNG ELECTRO MECH
7 patentsUS10939556B1Mar 2, 2021
Electronic component embedded substrate
SAMSUNG ELECTRO MECH3 citations71
US10932368B1Feb 23, 2021
Substrate-embedded electronic component
SAMSUNG ELECTRO MECH2 citations71
US11076488B2Jul 27, 2021
Board having electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations60
US12101880B2Sep 24, 2024
Printed circuit board
SAMSUNG ELECTRO MECH0 citations59
US10849226B2Nov 24, 2020
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations58
US10779409B2Sep 15, 2020
Printed circuit board
SAMSUNG ELECTRO MECH1 citations58
US11659665B2May 23, 2023
Connection structure embedded substrate
SAMSUNG ELECTRO MECH0 citations50
LG ELECTRONICS INC
3 patentsSK HYNIX INC
3 patentsUS11557355B2Jan 17, 2023
Semiconductor memory device and method of operating the semiconductor memory device
SK HYNIX INC0 citations58
US11302404B2Apr 12, 2022
Semiconductor memory device and method of operating the semiconductor memory device
SK HYNIX INC0 citations58
US11335406B2May 17, 2022
Memory device for performing program verify operation and method of operating the same
SK HYNIX INC0 citations50
SIM JAE-SUNG
2 patentsUS8441059B2May 14, 2013
Memory devices including vertical pillars and methods of manufacturing and operating the same
SIM JAE-SUNG34 citations91
US8588001B2Nov 19, 2013
Integrated circuit memory devices having vertically arranged strings of memory cells therein and methods of operating same
SIM JAE-SUNG4 citations61