Inventor

LEE MING-HAN

TW141 patents

⚠️ This page may combine multiple inventors who share the name “LEE MING-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE MING-HAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of forming metal interconnection

Method of forming metal interconnection

Semiconductor device and manufacturing method thereof

Graphene barrier layer

Semiconductor device with conductors embedded in a substrate

Method of forming metal interconnection

Interconnection structure and method for forming the same

Semiconductor device with interconnect structure having catalys layer

Via pre-fill on back-end-of-the-line interconnect layer

Integrated circuit interconnects and methods of making same

Method and apparatus for back end of line semiconductor device processing

Semiconductor packages and methods for forming the same

Semiconductor packages and methods for forming the same

Semiconductor packages and methods for forming the same

Method of forming graphene barrier layer in interconnect structure

Semiconductor packages with interconnection features in a seal region and methods for forming the same

Methods of performing chemical-mechanical polishing process in semiconductor devices

Method of forming graphene and metallic cap and barrier layers for interconnects

Graphene layer for reduced contact resistance

Methods of forming interconnect structures in semiconductor fabrication

Graphene-assisted low-resistance interconnect structures and methods of formation thereof

Interconnection structure and method for forming the same

Semiconductor interconnect structure having a graphene barrier layer

Semiconductor device with interconnecting structure and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor interconnect structure having graphene-capped metal interconnects

Interconnect structure and manufacturing method thereof

Method of forming metal interconnection

Method for via plating with seed layer

Interconnect structure including a continuous conductive body

Integrated circuit interconnect structure having discontinuous barrier layer and air gap

Protection liner on interconnect wire to enlarge processing window for overlying interconnect via

Semiconductor device and manufacturing method thereof

Semiconductor packages and methods for forming the same

Semiconductor structure and method for forming the same

Interconnect structure without barrier layer on bottom surface of via

Interconnects including graphene capping and graphene barrier layers

Interconnect structure including contact via over barrier layer

Graphene barrier layer for reduced contact resistance

Method for forming semiconductor structure

Semiconductor packages and methods for forming the same

Semiconductor packages and methods for forming the same

TAIWAN SEMICONDUCTOR MFG

Interconnect structure and manufacturing method thereof

Low resistance high reliability contact via and metal line structure for semiconductor device

Method and apparatus for back end of line semiconductor device processing

Semiconductor device metallization systems and methods

Interconnect having air gaps and polymer wrapped conductive lines

Method of semiconductor integrated circuit fabrication

TAIWAN SEMICONDCUTOR MFG COMPA

Forming diffusion barriers by annealing copper alloy layers

LEE MING HAN

Copper etch scheme for copper interconnect structure